DesignCon's "Engineer of the Year" Award is given out each year during the DesignCon event. The award recognizes the best of the best in engineering and new product advancements at the chip, board, or system level.
The award winner will be selected based on the leadership, creativity, and out-of-the-box thinking that he or she brings to design/test of chips, boards, or systems, with particular attention paid to signal and power integrity.
Nominations for the DesignCon 2020 Engineer of the Year will be open during the month of November and posted on the DesignCon and DesignNews websites. Members of the DesignNews editorial staff will choose finalists from the nominees, and then the DesignCon and DesignNews communities will have the opportunity to vote for the engineer who will receive the 2020 Award.
Nominees must be active members of the DesignCon community to be considered for this award.
The winner will be announced on Thursday, January 30, immediately before the keynote in the Elizabeth A. Hangs Theater and provided with a $1,000 grant or scholarship to present to the educational institution of his or her choice.
Official Rules for the DesignCon Engineer of the Year Award.
Questions? Please contact [email protected].
Past Engineer of the Year Award Recipients:
2019: Vishram Pandit
Vishram Pandit's goal is simple: Share knowledge with the technical community that will one day create the CPUs for next-generation cars, phones, and servers. He is well on his way to making that happen; to date he has co-authored a book on Power Integrity for I/O Interfaces, and is co-author of approximately 30 conference and journal publications, out of which 19 were presented at DesignCon. Those papers have received 3 best paper awards and 3 finalist awards. Vishram received the 2018 Albert Nelson Marquis Lifetime Achievement Award for his contributions to the Signal and Power integrity field.
Learn more about Vishram in an interview posted after he received the award.
2018: Dr. Mike Peng Li
After delivering 19 years' worth of tutorials and technical papers at DesignCon, Mike Peng Li, Intel Corp. Fellow, says the conference has become part of him. Mike has published approximately 110 technical papers, has earned 30 patents, has been named an IEEE Fellow, and has guided thousands of engineers, scientists, and students with his books and tutorials, especially in the area of jitter.
Read an interview with Dr. Li to learn more about his exceptional career.
2017: Heidi Barnes
Heidi Barnes is well known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies. She was selected for the award, in part, because of her dedication to problem solving and enthusiasm for leading and collaborating with teams.
Read more about Heidi in an interview following the reception of her award.
2016: Dr. Eric Bogatin
Eric was invited to present at the first DesignCon back in 1991 and has been doing so ever since. He says that the two essential ingredients to effective teaching are understanding what is confusing to the student, and encouraging participation and engagement. To foster the latter, Eric is known, to everyone's entertainment, for throwing chocolates out to students when they participate.
2015: Mike Steinberger
From communications analysis to IC design to microwave to software and more, Mike Steinberger has done a lot in his more than 30-year career. At the time of the award, Mike was responsible for leading SiSoft's ongoing tool development effort for the design and analysis of serial links in the 5-30 Gbps range, and had been instrumental in the development of high speed digital backplanes at various industry leaders.