Schedule Builder
- Monday
- Mon | 9:00am
- Monday, 9:00am-12:00pmSpeaker(s): Henry Wong, Xiaoqing Dong, Vincent Huang, Clarence Yu, Francois Tremblay, Geoffrey ZhangTrack(s): Jitter, Crosstalk, and Noise AnalysisMonday, 9:00am-12:00pmSpeaker(s): Craig Kirkpatrick (Agilent Technologies, Inc.), Robert Sleigh (Agilent), Yoji Sekine (Agilent Technologies)Track(s): High-Speed Serial DesignMonday, 9:00am-12:00pmSpeaker(s): Antonio Ciccomancini Scogna, Mauro Lai, Madhumitha Seshadhri, Darryl Kostka, Jonathan CasanovaTrack(s): PCB Design Tools and Methodologies
- Mon | 12:00pm
- Mon | 1:30pm
- Monday, 1:30pm-4:30pmSpeaker(s): Jose Moreira (Advantest), Koji Sasaki (Advantest)Track(s): Test and Measurement MethodologyMonday, 1:30pm-4:30pmMonday, 1:30pm-4:30pmSpeaker(s): Robert Sleigh (Agilent), Greg LeCheminant (Agilent Technologies), Brian Fetz (Agilent Technologies)Track(s): Sponsored TrainingMonday, 1:30pm-4:30pmSpeaker(s): Yuriy Shlepnev (Simberian)Track(s): Signal Propagation Analysis Techniques
- Mon | 3:00pm
- Mon | 4:45pm
- Monday, 4:45pm-6:00pmSpeaker(s): Chris Loberg, Ransom Stephens, Greg LeCheminant, Marty Miller, Pavel Zivny, Mike Li, Eric KvammeTrack(s): Jitter, Crosstalk, and Noise Analysis
- Tuesday
- Tues | 8:30am
- Tuesday, 8:30am-9:10amSpeaker(s): Sanku Mukherjee, Narayanan Mayandi, Brian Tsang, Sreeja Menon, Norman Chan, Arul SendhilTrack(s): System Co-Design: Chip/Package/Board
- Tues | 9:20am
- Tuesday, 9:20am-10:00amTuesday, 9:20am-10:00amSpeaker(s): Xiang Li (Intel Corp.)Track(s): PCB Design Tools and MethodologiesTuesday, 9:20am-10:00amSpeaker(s): John Pickerd (Tektronix), Kan Tan (Tektronix)Track(s): Sponsored TrainingTuesday, 9:20am-10:00amTuesday, 9:20am-10:00amSpeaker(s): Greg Caswell (DfR Solutions)Track(s): System Co-Design: Chip/Package/BoardTuesday, 9:20am-10:00amSpeaker(s): Xiaoxiong Gu, Young H. Kwark, Christian W. Baks, Lei Shan, Xiaomin Duan, Sebastian Mueller, Christian Schuster, Thomas-Michael Winkel, Thomas Strach, Hubert Harrer, Renato Rimolo-DonadioTrack(s): High-Speed Serial Design
- Tues | 10:15am
- Tuesday, 10:15am-10:55amSpeaker(s): Marc Verdiell (Samtec)Track(s): System Co-Design: Chip/Package/BoardTuesday, 10:15am-10:55amTuesday, 10:15am-10:55amSpeaker(s): Per Viklund (Mentor Graphics)Track(s): PCB Design Tools and Methodologies
- Tues | 11:05am
- Tuesday, 11:05am-11:45amTuesday, 11:05am-11:45amSpeaker(s): Istvan Novak, Ying Li, Eben Kunz, Sarah Paydavosi, Laura J. Kocubinski, Kevin Hinckley, Alexander Nosovitski, Nathaniel Shannon, Jason R. Miller, Gustavo J. BlandoTrack(s): PCB Design Tools and MethodologiesTuesday, 11:05am-11:45amTuesday, 11:05am-11:45amSpeaker(s): Chris Scholz, Ph.D (Rohde & Schwarz)Track(s): Sponsored Training
- Tues | 12:15pm
- Tues | 12:45pm
- Tues | 1:00pm
- Tues | 2:00pm
- Tuesday, 2:00pm-2:40pmSpeaker(s): Bipin Dhavale, June Feng, Yuri Tretiakov, Janani Chandrasekhar, Shishuang Sun, Mayra Sarmiento, Sunitha Chandra, Daniel Chow, Aman AflakiTuesday, 2:00pm-2:40pmSpeaker(s): Bo Yu (Intel), Lomberto Jimenez (Intel)Track(s): System Co-Design: Chip/Package/Board
- Tues | 2:50pm
- Tuesday, 2:50pm-3:30pmSpeaker(s): Peter Pupalaikis (Teledyne LeCroy), Kaviyesh Doshi (Teledyne LeCroy)Track(s): Test and Measurement MethodologyTuesday, 2:50pm-3:30pmSpeaker(s): Paul Huray (University of South Carolina), Priya Pathmanathan (Intel Corporation), Steve Pytel (ANSYS, Inc.)Tuesday, 2:50pm-3:30pmTuesday, 2:50pm-3:30pmTuesday, 2:50pm-3:30pmSpeaker(s): Xiaohong Jiang, Hong Shi, Siow Chek Tan, Joe Sanchez, Yuri Tretiakov, June Feng, Chee Heng LohTrack(s): High-Speed Serial DesignTuesday, 2:50pm-3:30pm
- Tues | 3:45pm
- Tuesday, 3:45pm-5:00pmTuesday, 3:45pm-4:25pmSpeaker(s): Patrick Mannion, Shachi Nandan Kakkar, Manan Mehta, Lloyd Walker, Amanda Pratt, Andrew MilluzziTrack(s): Special Events
- Tues | 5:00pm
Wednesday
Wednesday, 8:30am-9:10am
Speaker(s): Youngsoo Lee (Samsung Electronics), Dongyoun Yi (Samsung Electronics)
Wednesday, 8:30am-9:10am
Speaker(s): Xiaoxia Zhou, Hongmei Fan, Jing Li, Kam Taunk, Alpesh Bhobe, Jinghan Yu, Philippe Sochoux
Wednesday, 9:20am-10:00am
Speaker(s): Mandy (Ying) Ji, Ming Li, Julia Cline, David Secker, Kevin Cai, John Lau, Pei-Jer Tzeng, Chau-Jie Zhan, Ching-Kuan Lee
Wednesday, 9:20am-10:00am
Wednesday, 9:20am-10:00am
Speaker(s): Eric Bogatin (Bogatin Enterprises), Bert Simonovich (Lamsim Enterprises Inc.)
Track(s): Jitter, Crosstalk, and Noise Analysis
Wednesday, 9:20am-10:00am
Wednesday, 9:20am-10:00am
Wednesday, 9:20am-10:00am
Speaker(s): Vadim Heyfitch (Avago Technologies)
Track(s): Signal Propagation Analysis Techniques
Wednesday, 9:20am-10:00am
Speaker(s): Billy Koo (Samsung Electronics), Sangmin Lee (Samsung Electronics), Woonghwan Ryu (Samsung Electronics)
Track(s): Parallel and Memory Interface Design
Wednesday, 10:15am-10:55am
Wednesday, 10:15am-10:55am
Speaker(s): Yin-Chen Yu (SiTime Corporation), Jehangir (JP) Parveresh (SiTime Corporation), Sassan Tabatabaei (SiTime Corporation)
Wednesday, 10:15am-10:55am
Wednesday, 10:15am-10:55am
Speaker(s): Vladimir Dmitriev-Zdorov (Mentor Graphics), Scott McMorrow (Teraspeed)
Track(s): Signal Propagation Analysis Techniques
Wednesday, 11:05am-11:45am
Speaker(s): Daniel Dvorscak (ANSYS), Michael Tsuk (ANSYS)
Track(s): Signal Propagation Analysis Techniques
Wednesday, 11:05am-11:45am
Speaker(s): Christopher DiMinico (MC Communications), Mike Sapozhnikov (Cisco Systems), Mike Resso (Agilent)
Wednesday, 11:05am-11:45am
Speaker(s): Shashank Prasad (Cadence Design Systems), Kamal Preet Singh (Cadence Design Systems)
Wednesday, 11:05am-11:45am
Wednesday, 11:05am-11:45am
Wednesday, 2:00pm-2:40pm
Wednesday, 2:00pm-2:40pm
Wednesday, 2:00pm-2:40pm
Speaker(s): John Ellis (Synopsys)
Track(s): Parallel and Memory Interface Design
Wednesday, 2:00pm-2:40pm
Wednesday, 2:50pm-3:30pm
Speaker(s): Francesco De Paulis, Muhammet Hilmi Nisanci, Antonio Orlandi, Xiaoxiong Gu, Renato Rimolo-Donadio, Christian W. Baks, Sam Connor, Bruce Archambeault, Young H. Kwark
Wednesday, 2:50pm-3:30pm
Wednesday, 2:50pm-3:30pm
Wednesday, 2:50pm-3:30pm
Speaker(s): Edward Frlan (Semtech), Francois Tremblay (Semtech, Gennum Products Group)
Track(s): High-Speed Serial Design
Wednesday, 2:50pm-3:30pm
Speaker(s): David Blaza (UBM Tech, Electronics), Patrick Mannion (UBM Tech, Electronics)
Track(s): Special Events
Wednesday, 2:50pm-3:30pm
Speaker(s): Christian W. Baks, Renato Rimolo-Donadio, Young H. Kwark, Fuad Doany, Xiaoxiong Gu, Daniel Kuchta, Benjamin Lee, Alexander Rylyakov, Frank Libsch, Clint Schow
Track(s): Test and Measurement Methodology
Wednesday, 2:50pm-3:30pm
Speaker(s): Martin Miller (Teledyne LeCroy)
Track(s): Jitter, Crosstalk, and Noise Analysis
Wednesday, 2:50pm-3:30pm
Speaker(s): Chanmin Jo, Baek-Kyu Choi, Sangmin Lee, Seungbae Lee, Yonghoon Kim, Seongjae Moon, Minho Seo
Track(s): Parallel and Memory Interface Design
Wednesday, 3:00pm-4:30pm
Speaker(s): Alan Blankman, Ph.D. (Teledyne LeCroy)
Track(s): Sponsored Training
Wednesday, 3:45pm-5:00pm
Speaker(s): Hung Vuong (Qualcomm), Perry Keller (Agilent Technologies)
Track(s): Parallel and Memory Interface Design
Thursday
Thursday, 9:50am-10:30am
Speaker(s): Mike Jenkins (Xilinx), David Mahashin (Xilinx)
Track(s): High-Speed Serial Design
Thursday, 9:50am-10:30am
Thursday, 10:40am-11:20am
Speaker(s): Jonghyun Cho, Joohee Kim, Hyun-Cheol Baie, Kwangseong Choi, Seungwook Paek, Lee-Sup Kim, Joungho Kim
Track(s): Parallel and Memory Interface Design
- A
- Title: Distinguished Engineer
Company: Cisco Systems Inc - Title: Staff Signal Integrity Engineer
Company: Altera - Title: Associate Professor
Company: Penn State Harrisburg - Title: Principal Engineer
Company: Molex - Title: Director
Company: Molex - Title: VP of Marketing
Company: Breker Verification Systems - Title: Distingusihed Engineer
Company: IBM - Title: Engineering Director
Company: Polar Instruments - Title: Distinguished Engineer
Company: LSI
- B
- Title: PhD Candidate
Company: KAIST - Title: Senior Engineer
Company: ETRI - Title: Staff Engineer
Company: IBM T.J. Watson Research Center - Title: Senior Technical Staff Member
Company: University of New Hampshire Inter Operability Laboratory - Title: Senior IC Modeling Engineer
Company: Maxim Integrated Products - Title: Senior Application Expert
Company: Agilent Technologies - Title: Senior Applications Engineer
Company: Agilent Technoligies - Title: Senior Hardware Design Engineer
Company: Tektronix - Title: Senior Signal Integrity Engineer
Company: Cray Inc. - Title: Director of Engineering
Company: Wild River Technology - Title: Senior Principal Engineer
Company: Rambus - Title: Technical Leader/HW Manager
Company: Cisco Systems - Title: Principal Hardware Engineer
Company: Oracle - Title: Technical Product Manager, Signal Integrity
Company: Teledyne LeCroy - Title: Vice President
Company: UBM Tech, Electronics - Title: Signal Integrity Evangelist
Company: Bogatin Enterprises - Title: Design Engineering Specialist
Company: Celestica - Title: Electrical Project Engineer
Company: Molex - Title: ASIC Application Engineer
Company: IBM - Title: Marketing Manager
Company: R & D Circuits - Title: Sr. Staff Product Engineer
Company: Cadence - Title: Staff PCB and Packaging Technologist
Company: Intel - Title: Principal Member of Technical Staff
Company: SiSoft - Title: Project Engineer
Company: Molex - Title: Technical Marketing Specialist
Company: Polar Instruments Ltd. - Title: Manager of Product Marketing
Company: Anritsu
- C
- Title: Senior Principal Engineer
Company: Rambus - Title: Engineer
Company: Xilinx - Title: Signal Integrity Engineer
Company: Intel - Title: Senior Member of the Technical Staff
Company: DfR Solutions - Title: SPE
Company: Rambus Inc - Title: Staff Corporate Application Engineer
Company: Synopsys - Title: Signal Integrity Engineer
Company: Altera Corp - Title: Sr Signal Integrity Engineer
Company: Altera Corporation - Title: VP of Product Development
Company: ANSYS/Apache - Title: PhD Student
Company: KAIST - Title: Research Engineer
Company: SK Hynix - Title: Senior Engineer
Company: Samsung Electronics - Title: Senior Engineer
Company: ETRI - Title: Principal Signal Integrity Engineer
Company: Altera - Title: SMTS II DFT
Company: Rambus Inc. - Title: EDA Market Development Manager
Company: CST - Title: EDA Market Development Manager
Company: CST of America - Title: Undergraduate Student
Company: Penn State Harrisburg - Title: Manager
Company: Rambus - Title: Senior Technical Staff Member
Company: IBM - Title: Sr. Consulting Application Engineer
Company: Synopsys
- D
- Title: System Engineer
Company: LSI N17 - Title: Development Engineer
Company: IBM - Title: Application Engineer
Company: Rohde & Schwarz - Title: Analog/Mixed Signal/RF Design Verification Senior Staff Engineer
Company: Qualcomm - Title: Research Associate
Company: University of LAquila - Title: President
Company: CCN Labs - Title: Director
Company: LSI - Title: Senior Signal and Power Delivery Engineer
Company: Altera - Title: President/CTO
Company: MC Communications - Title: Staff Hardware Engineer
Company: IBM - Title: Principal Engineer
Company: Mentor Graphics - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: Signal Integrity Research Engineer
Company: Huawei Technologies - Title: Senior DSP Engineer
Company: Teledyne LeCroy - Title: Signal Integrity Engineer
Company: IBM
- Title: Postdoctoral Researcher
Company: Technical University of Hamburg-Harburg - Title: Engineer
Company: AWR - Title: Technical Services Engineer
Company: ANSYS
- E
- Title: PCI-SIG Board of Directors
Company: Agilent Technologies - Title: Senior Engineer
Company: IBM - Title: Expert, Signal Integrity and Timing Analysis
Company: Ericsson AB - Title: Product Marketing Manager for SPICE Simulation
Company: Synopsys - Title: Principal Engineer
Company: Synopsys - Title: Chief Technology Engineer
Company: Granite River Labs - Title: Executive Director, IC Design
Company: Maxim Integrated
- F
- Title: EMC Engineer
Company: Cisco Systems (China) R&D Co. - Title: Professor
Company: Missouri University of Science and Technology - Title: Senior Principal MTS
Company: Maxim Integrated - Title: MTS
Company: Altera - Title: Marketing
Company: Agilent Technologies - Title: Engineering Manager
Company: Intel - Title: Senior Signal Integrity Engineer
Company: Molex - Title: Senior Engineering Manager
Company: Rambus - Title: Senior Hardware Architect
Company: Semtech
- G
- Title: Senior Principal Engineer
Company: Rambus - Title: Senior Product Marketing Engineer
Company: Agilent Technologies - Title: Research Staff Member
Company: IBM T.J. Watson Research Center
- H
- Title: Analog Engineer
Company: Intel Corporation - Title: Principal Engineer
Company: Xilinx - Title: Senior Technical Staff Member
Company: IBM Research and Development - Title: Analog Engineer
Company: Intel - Title: Distinguished Engineer
Company: LSI - Title: EMC Design Engineer
Company: Siemens - Title: Design Engineer
Company: Avago Technologies - Title: Principal Engineer
Company: Cray - Title: Founding Partner
Company: SILENT Solutions LLC - Title: PhD Student
Company: University of LAquila - Title: Principal Hardware Engineer
Company: Oracle Corp - Title: Signal Integrity Engineer
Company: TE Connectivity - Title: Engineer
Company: Intel - Title: Professor
Company: University of South Carolina - Title: Staff Corporate Application Engineer
Company: Synopsys - Title: Senior Engineer
Company: Samsung Electronics
- I
- Title: Senior RF Platform Engineer
Company: National Instruments
- J
- Title: Senior Manager, EMC Team
Company: Nvidia - Title: EMC Engineer
Company: IBM - Title: Senior Staff Design Engineer
Company: Xilinx - Title: Principal Engineer
Company: Rambus - Title: System Design Engineer
Company: Rambus - Title: Senior MTS
Company: Altera - Title: System Engineer
Company: Intel - Title: Senior Engineer
Company: Samsung Electronics - Title: Graduate student
Company: KAIST
- K
- Title: High School Student
Company: Cupertino High School - Title: Engineering Manager
Company: Intel - Title: Senior Member of Technical Staff
Company: Altera - Title: Chairman of UFSA Compliance Committee
Company: Agilent Technologies - Title: Design Engineering Manager
Company: Celestica - Title: Professor
Company: UNIST
- Title: PhD candidate
Company: KAIST - Title: Professor
Company: KAIST - Title: Professor
Company: KAIST - Title: Senior Staff Engineer
Company: Qualcomm - Title: Senior Engineer
Company: Samsung Electronics - Title: Senior Field Applications Engineer
Company: Agilent Technologies, Inc. - Title: Signal Integrity Engineer
Company: Samtec - Title: Hardware Engineer
Company: Oracle - Title: PhD Candidate
Company: KAIST - Title: Principal Engineer
Company: Samsung Electronics - Title: Application Engineer
Company: CST of America, Inc. - Title: System Enginner
Company: LSI - Title: Product Marketing Engineer
Company: Agilent Technologies - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: Engineer
Company: Oracle - Title: Senior Staff Engineer
Company: Intel - Title: Principal Engineer, Serdes Validation
Company: LSI Corp. - Title: Research Staff Member
Company: IBM T.J. Watson Research Center
- L
- Title: Senior Analog engineer
Company: Intel - Title: Fellow
Company: Industrial Technology Research Institute Taiwan - Title: Technical Applications Engineer
Company: Agilent Technologies - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: Research Scientist
Company: ITRI - Title: Senior Engineer
Company: SK Hynix - Title: Principal Engineer
Company: Samsung Electronics - Title: Senior Engineer
Company: Samsung Electronics - Title: Senior Engineer
Company: Samsung Electronics - Title: Technical Product Manager, Serial Data
Company: Teledyne LeCroy - Title: Co-Op Student Worker
Company: Cisco Systems - Title: Fellow
Company: Altera - Title: Senior Principal Engineer
Company: Rambus - Title: Signal Integrity Manager
Company: Intel - Title: Senior Hardware Engineer
Company: Intel Corp. - Title: Hardware Engineer
Company: Oracle - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: AMS Verification Engineer
Company: Intel - Title: Distinguished Engineer and SerDes Architecture Manager
Company: LSI - Title: Design Engineering Manager
Company: Celestica - Title: Staff Hardware Engineer
Company: IBM - Title: Engineer
Company: Intel - Title: Senior Technical Marketing Manager
Company: Tektronix-Danaher - Title: Engineer
Company: Altera - Title: Signal Integrity Lead
Company: Intel
- M
- Title: Product Engineer
Company: ANSYS/Apache - Title: Principal Product Manager
Company: National Instruments - Title: Senior Principal Engineer, Signal Integrity
Company: Rambus - Title: Staff Systems Applications Engineer
Company: Xilinx - Title: Technical Manager
Company: LSI - Title: Senior Staff Product Engineer
Company: Cadence Design Systems, Inc. - Title: Director of Content
Company: UBM Tech, Electronics - Title: Fellow
Company: Anritsu - Title: Senior Systems Engineer
Company: Rambus, Inc. - Title: SI/PI Engineer
Company: Xilinx - Title: President
Company: Teraspeed - Title: Senior Signal Integrity Engineer
Company: Nvidia - Title: Reliability Engineer
Company: Solectria Renewables - Title: Principal Engineer
Company: Intel - Title: Senior Member of Technical Staff
Company: Rambus Inc - Title: Senior Staff R&D Engineer
Company: Synopsys Inc - Title: Principal Hardware Engineer
Company: Oracle - Title: Chief Scientist
Company: Teledyne LeCroy - Title: Principal Engineer
Company: LeCroy - Title: PhD Student
Company: University of Florida - Title: SI/Application Engineer
Company: Intel Corp. - Title: Distinguished Engineer
Company: LSI - Title: R&D Manager
Company: Advantest - Title: Senior Engineer
Company: Samsung Electronics - Title: Professor of EE
Company: Penn State Harrisburg - Title: Senior Engineer
Company: Advantest - Title: Senior Principal Engineer
Company: TE Connectivity - Title: Application Engineer
Company: Texas Instruments - Title: Senior Group Manager
Company: National Instruments - Title: Research Assistant
Company: Technical University of Hamburg-Harburg - Title: Software Developer
Company: National Instruments - Title: Senior Member of Technical Staff II
Company: Rambus Inc - Title: Senior Principal Engineer
Company: Rambus
- N
- Title: Sr. SI&EMI Engineer
Company: Samtec - Title: R&D Manager
Company: ANSYS - Title: Electrical Engineer
Company: Molex - Title: Chief Technologist
Company: Wild River Technology - Title: Principal Hardware Engineer
Company: Oracle Corp - Title: Senior Principal Hardware Engineer
Company: Oracle
- O
- Title: Signal and Power Integrity Architect
Company: Altera - Title: Principal Member of Technical Staff
Company: Maxim Integrated Products - Title: Senior Engineer
Company: DuPont - Title: Professor
Company: University of LAquila
- P
- Title: PhD student
Company: KAIST - Title: Hardware Engineer
Company: Cisco Systems - Title: Senior Product Specialist
Company: ANSYS - Title: Engineer
Company: Intel - Title: Staff Hardware Engineer
Company: IBM - Title: Staff Signal Integrity Engineer
Company: Intel - Title: Senior Manager of Customer Engineering
Company: SiTime Corporation - Title: Principal Engineer
Company: Dell - Title: Senior Analog Engineer
Company: Intel Corporation - Title: Hardware Engineer
Company: Oracle - Title: Associate Professor
Company: KU Leuven University - Title: Senior Member of Consulting Staff
Company: Cadence Design Systems - Title: MSEE Student
Company: UC Berkeley - Title: Vice President, Technology Development
Company: Teledyne LeCroy - Title: Signal Integrity Product Manager
Company: ANSYS, Inc.
- R
- Title: Principal Member of Technical Staff, IC Modeling
Company: Maxim Integrated - Title: Principal Engineer
Company: Intel Corporation - Title: Senior Engineer
Company: Intel - Title: Master R&D Engineer, Analog/RF Simulation and Signal Integrity
Company: Agilent Technologies - Title: Member of Technical Staff
Company: Altera - Title: Signal Integrity Engineer
Company: Intel - Title: Business Development Manager
Company: Agilent - Title: Postdoctoral Researcher
Company: IBM T.J. Watson Research Center - Title: Postdoctoral Researcher
Company: IBM T.J. Watson Research Center - Title: President
Company: Speeding Edge - Title: Project Electrical Engineer
Company: Molex - Title: Senior Editor
Company: The Connecting Edge - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: Principal Manager
Company: Samsung Electronics
- S
- Title: Engineer
Company: Altera - Title: Technical Leader
Company: Cisco Systems - Title: MTS Design Engineer
Company: Altera Corporation - Title: Senior Engineer
Company: Advantest - Title: Engineering Support Manager
Company: CST of America, Inc. - Title: Business Development Manager
Company: Rohde & Schwarz - Title: Product Manager
Company: Rohde & Schwarz - Title: Research Staff Member
Company: IBM T.J. Watson Research Center - Title: Professor
Company: Technical University of Hamburg-Harburg - Title: Technical Director
Company: Rambus - Title: Marketing Engineer
Company: Agilent Technologies - Title: Engineering Manager
Company: Rambus Chip Technologies India - Title: Senior Engineer
Company: Samsung Electronics - Title: SI Engineer
Company: Intel - Title: Staff Researcher
Company: IBM T.J. Watson Research Center - Title: Signal Integrity Engineer
Company: TE Connectivity - Title: Product Specialist
Company: ANSYS - Title: Signal Integrity Hardware Engineer
Company: Oracle - Title: Senior Manager
Company: Altera - Title: Founder and CTO
Company: Orora Design Technologies - Title: Senior Signal Integrity Engineer
Company: Altera - Title: Senior Member of Technical Staff
Company: Altera - Title: Student
Company: UNIST - Title: President
Company: Simberian - Title: Student
Company: Missouri S&T - Title: Senior EMC Manager of Schenzhen Nvidia Team
Company: Nvidia - Title: Signal Integrity Engineer
Company: Intel - Title: President
Company: Lamsim Enterprises Inc. - Title: Member of Consulting Staff
Company: Cadence Design Systems - Title: Application Engineer
Company: CST of America, Inc. - Title: Senior Product Manager
Company: Agilent - Title: Engineering Manager
Company: Cisco Systems - Title: Lead Architect
Company: SiSoft - Title: Software Developer
Company: National Instruments - Title: Science Writer
Company: Ransoms Notes - Title: Staff Engineer
Company: IBM Research and Development - Title: Manager, Signal Integrity
Company: Altera - Title: Sr. Architect
Company: Cadence Design Systems - Title: Engineer
Company: AMD - Title: Hardware Designer
Company: Ericsson AB
- T
- Title: Director, Strategic Applications
Company: SiTime Corporation - Title: Professional
Company: Elpida - Title: Senior Software Engineer
Company: Tektronix - Title: Engineer
Company: Altera - Title: EMC Compliance Engineer
Company: Cisco Systems - Title: Principal SI Consultant
Company: SI Guys - Title: Staff Technical Marketing Manager
Company: Synopsys - Title: Senior Product Marketing Manager
Company: Synopsys - Title: Member of Technical Staff
Company: Altera - Title: Vice President, Design Engineering
Company: Semtech, Gennum Products Group - Title: Product Engineer, Sr. MTS
Company: Altera - Title: Systems Design Engineering
Company: Rambus, Inc - Title: Principal R&D Engineer
Company: ANSYS - Title: Senior Member of Technical Staff II
Company: Rambus Inc. - Title: Engineer
Company: Industrial Technology Research Institute Taiwan
- U
- Title: Graduate Student
Company: Penn State Harrisburg
- V
- Title: Director, System Solutions Engineering
Company: Rambus - Title: R&D Manager
Company: Agilent Technologies - Title: CTO, Samtec Optical Group
Company: Samtec - Title: Director, RF and IC Packaging
Company: Mentor Graphics - Title: Senior Applications Consultant
Company: Synopsys - Title: Principal Engineer
Company: Synopsys - Title: Manager, Memory Standards
Company: Qualcomm
- W
- Title: Product Engineer
Company: National Instruments - Title: Aviation Engineering Student
Company: San Jose State University - Title: Principal Member of Technical Staff
Company: Maxim Integrated Products - Title: Senior Staff Engineer
Company: Synopsys - Title: CTO
Company: IPBlox - Title: Former Exchange Student
Company: Penn State Harrisburg - Title: Principal Signal Integrity Engineer
Company: SiSoft - Title: Board of Directors, Chair, VESA
Company: Parade Technologies - Title: Technical Leader zMR
Company: IBM Research and Development - Title: Principal Engineer
Company: Gennum - Title: Marketing Manager, Communications and Semiconductors
Company: Mathworks, Inc - Title: Principal Engineer
Company: Altera - Title: Senior Engineer
Company: Molex - Title: Senior Staff Signal Integrity Engineer
Company: Xilinx
- X
- Title: Analog Engineer
Company: Intel Corp
- Y
- Title: Software Development Engineer, A/RF Simulation and Models
Company: Agilent Technologies - Title: Assistant Engineer
Company: Samsung Electronics - Title: Advisory Hardware Engineer
Company: IBM - Title: Analog Engineer
Company: Intel - Title: Manager
Company: TE Connectivity - Title: Engineering Manager
Company: Cisco Systems (China) R&D Co. - Title: Senior Manager of Customer Engineering
Company: SiTime Corporation - Title: Principal Engineer
Company: Samsung Electronics
- Z
- Title: Senior SI/PI/EMC Engineer
Company: Nvidia - Title: Engineer
Company: Industrial Technology Research Institute+N248 Taiwan - Title: Technical Adviser
Company: Huawei Technologies - Title: EMC Engineer
Company: Cisco Systems (China) R&D Co. - Title: Domain expert HSSD
Company: Tektronix
- Monday
- Monday, January 28, 2013 | 9:00am-12:00pmSpeaker(s): Henry Wong (Gennum), Xiaoqing Dong (Huawei Technologies), Vincent Huang (TE Connectivity), Clarence Yu (TE Connectivity), Francois Tremblay (Semtech, Gennum Products Group), Geoffrey Zhang (Huawei Technologies)Track(s): Jitter, Crosstalk, and Noise Analysis
- Monday, January 28, 2013 | 9:00am-12:00pmSpeaker(s): Craig Kirkpatrick (Agilent Technologies, Inc.), Robert Sleigh (Agilent), Yoji Sekine (Agilent Technologies)Track(s): High-Speed Serial Design
- Monday, January 28, 2013 | 9:00am-12:00pmSpeaker(s): James Bell (Wild River Technology), Josiah Bartlett (Tektronix), Bob Buxton (Anritsu), Jon Martens (Anritsu), Alfred Neves (Wild River Technology)Track(s): Test and Measurement Methodology
- Monday, January 28, 2013 | 9:00am-12:00pmSpeaker(s): Antonio Ciccomancini Scogna (CST), Mauro Lai (Intel), Madhumitha Seshadhri (Intel), Darryl Kostka (CST of America, Inc.), Jonathan Casanova (Intel)Track(s): PCB Design Tools and Methodologies
- Monday, January 28, 2013 | 9:00am-12:00pmSpeaker(s): John Dunn (AWR)Track(s): Signal Propagation Analysis Techniques
- Monday, January 28, 2013 | 1:30pm-4:30pmSpeaker(s): Jose Moreira (Advantest), Koji Sasaki (Advantest)Track(s): Test and Measurement Methodology
- Monday, January 28, 2013 | 1:30pm-4:30pmSpeaker(s): Helene Thibieroz (Synopsys), Mike Woodward (Mathworks, Inc), Michael Mirmak (Intel Corp.), Dave Cronauer (Synopsys), Ozan Erdogan (Maxim Integrated)
- Monday, January 28, 2013 | 1:30pm-4:30pmSpeaker(s): Robert Sleigh (Agilent), Greg LeCheminant (Agilent Technologies), Brian Fetz (Agilent Technologies)Track(s): Sponsored Training
- Monday, January 28, 2013 | 1:30pm-4:30pmSpeaker(s): Mike Li (Altera)Track(s): Jitter, Crosstalk, and Noise Analysis
- Monday, January 28, 2013 | 1:30pm-4:30pmSpeaker(s): Yuriy Shlepnev (Simberian)Track(s): Signal Propagation Analysis Techniques
- Monday, January 28, 2013 | 3:00pm-4:30pmSpeaker(s): David Li (Teledyne LeCroy)Track(s): Sponsored Training
- Monday, January 28, 2013 | 4:45pm-6:00pmSpeaker(s): Chris Loberg (Tektronix-Danaher), Ransom Stephens (Ransoms Notes), Greg LeCheminant (Agilent Technologies), Marty Miller (LeCroy), Pavel Zivny (Tektronix), Mike Li (Altera), Eric Kvamme (LSI Corp.)Track(s): Jitter, Crosstalk, and Noise Analysis
- Tuesday
- Tuesday, January 29, 2013 | 8:30am-9:10amSpeaker(s): Sanku Mukherjee (Rambus Inc), Narayanan Mayandi (Rambus, Inc.), Brian Tsang (Rambus, Inc), Sreeja Menon (Rambus Inc), Norman Chan (Rambus Inc), Arul Sendhil (Rambus Chip Technologies India)Track(s): System Co-Design: Chip/Package/Board
- Tuesday, January 29, 2013 | 8:30am-9:10amSpeaker(s): Mike Schnecker (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Aldo Morales (Penn State Harrisburg), Sedig Agili (Penn State Harrisburg), Ashraf Umar (Penn State Harrisburg), Marcel Christoph Welpot (Penn State Harrisburg), Mike Resso (Agilent)
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Xiang Li (Intel Corp.)Track(s): PCB Design Tools and Methodologies
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): John Pickerd (Tektronix), Kan Tan (Tektronix)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Ketan Shringarpure (Missouri S&T), Siming Pan (Cisco Systems), Brice Achkir (Cisco Systems Inc), Bruce Archambeault (IBM), Jun Fan (Missouri University of Science and Technology), Jingook Kim (UNIST)
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Greg Caswell (DfR Solutions)Track(s): System Co-Design: Chip/Package/Board
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Xiaoxiong Gu (IBM T.J. Watson Research Center), Young H. Kwark (IBM T.J. Watson Research Center), Christian W. Baks (IBM T.J. Watson Research Center), Lei Shan (IBM T.J. Watson Research Center), Xiaomin Duan (Technical University of Hamburg-Harburg), Sebastian Mueller (Technical University of Hamburg-Harburg), Christian Schuster (Technical University of Hamburg-Harburg), Thomas-Michael Winkel (IBM Research and Development), Thomas Strach (IBM Research and Development), Hubert Harrer (IBM Research and Development), Renato Rimolo-Donadio (IBM T.J. Watson Research Center)Track(s): High-Speed Serial Design
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Gregory Fitzgerald (Molex), Munawar Ahmad (Molex), Mark Bugg (Molex), Michael Rost (Molex)Track(s): Test and Measurement Methodology
- Tuesday, January 29, 2013 | 9:20am-10:00amSpeaker(s): Mike Schnecker (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Jose Moreira (Advantest), Marc Moessinger (Advantest), Masayuki Takahashi (Elpida), Thomas Bresnan (R & D Circuits)Track(s): Test and Measurement Methodology
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Marc Verdiell (Samtec)Track(s): System Co-Design: Chip/Package/Board
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Vira Ragavassamy (Intel Corporation), Arul Kandasamy (Intel), David Figueroa (Intel), Jiangqi He (Intel)
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Per Viklund (Mentor Graphics)Track(s): PCB Design Tools and Methodologies
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Rick Daniel (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 10:15am-10:55amSpeaker(s): Xingdong Dai (LSI N17), Fangyi Rao (Agilent Technologies), Shiva Kotagiri (LSI), Cathy Liu (LSI)Track(s): High-Speed Serial Design
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Andrew Becker (Cray Inc.), Michael Higgins (Cray), Michael Steinberger (SiSoft), Paul Wildes (SiSoft)
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Istvan Novak (Oracle), Ying Li (Oracle), Eben Kunz (Oracle), Sarah Paydavosi (Oracle), Laura J. Kocubinski (Oracle), Kevin Hinckley (Oracle Corp), Alexander Nosovitski (Oracle Corp), Nathaniel Shannon (Oracle), Jason R. Miller (Oracle), Gustavo J. Blando (Oracle)Track(s): PCB Design Tools and Methodologies
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Mahbubul Bari (Maxim Integrated Products), Ron Olisar (Maxim Integrated Products), Hassan Rafat (Maxim Integrated), Fangyi Rao (Agilent Technologies), Ming Yan (Agilent Technologies), Sharon Wang (Maxim Integrated Products)Track(s): High-Speed Serial Design
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Richard Sjiariel (CST of America, Inc.), Joachim Held (Siemens)
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Brian MacCleery (National Instruments), Oleg Stepanov (National Instruments), Muris Mujagic (National Instruments), Mahmoud Wahby (National Instruments)
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Stephen Pan (ANSYS), Norman Chang (ANSYS/Apache), Mark Qi Ma (ANSYS/Apache), Gokul V Shankaran (ANSYS), Manoj Nagulapally (ANSYS)Track(s): System Co-Design: Chip/Package/Board
- Tuesday, January 29, 2013 | 11:05am-11:45amSpeaker(s): Chris Scholz, Ph.D (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 1:00pm-1:40pmSpeaker(s): Eric Bogatin (Bogatin Enterprises)Track(s): Special Events
- Tuesday, January 29, 2013 | 1:00pm-1:40pmSpeaker(s): Mike Schnecker (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 2:00pm-2:40pmSpeaker(s): Bipin Dhavale (Altera), June Feng (Altera), Yuri Tretiakov (Altera), Janani Chandrasekhar (Altera Corporation), Shishuang Sun (Altera), Mayra Sarmiento (Altera Corporation), Sunitha Chandra (Altera Corp), Daniel Chow (Altera), Aman Aflaki (Altera)
- Tuesday, January 29, 2013 | 2:00pm-2:40pmSpeaker(s): Bo Yu (Intel), Lomberto Jimenez (Intel)Track(s): System Co-Design: Chip/Package/Board
- Tuesday, January 29, 2013 | 2:00pm-2:40pmSpeaker(s): Jack Carrel (Xilinx), Heidi Barnes (Agilent Technoligies), Mike Resso (Agilent), Robert Sleigh (Agilent), Hoss Hakimi (Xilinx)Track(s): Test and Measurement Methodology
- Tuesday, January 29, 2013 | 2:00pm-2:40pmSpeaker(s): Mike Schnecker (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 2:50pm-3:30pmSpeaker(s): Peter Pupalaikis (Teledyne LeCroy), Kaviyesh Doshi (Teledyne LeCroy)Track(s): Test and Measurement Methodology
- Tuesday, January 29, 2013 | 2:50pm-3:30pmSpeaker(s): Paul Huray (University of South Carolina), Priya Pathmanathan (Intel Corporation), Steve Pytel (ANSYS, Inc.)
- Tuesday, January 29, 2013 | 2:50pm-3:30pm
- Tuesday, January 29, 2013 | 2:50pm-3:30pm
- Tuesday, January 29, 2013 | 2:50pm-3:30pmSpeaker(s): Xiaohong Jiang (Altera), Hong Shi (Altera), Siow Chek Tan (Altera), Joe Sanchez (Altera), Yuri Tretiakov (Altera), June Feng (Altera), Chee Heng Loh (Altera)Track(s): High-Speed Serial Design
- Tuesday, January 29, 2013 | 2:50pm-3:30pmSpeaker(s): Rick Daniel (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 2:50pm-3:30pmSpeaker(s): Weiliang Yuan (Samsung Electronics), Sangmin Lee (Samsung Electronics), Woonghwan Ryu (Samsung Electronics), Chanmin Jo (Samsung Electronics), Seungbae Lee (Samsung Electronics)
- Tuesday, January 29, 2013 | 3:45pm-5:00pmSpeaker(s): Antonio Ciccomancini Scogna (CST of America), Darryl Kostka (CST of America, Inc.), Martin Schauer (CST of America, Inc.), Richard Sjiariel (CST of America, Inc.)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 3:45pm-5:00pmSpeaker(s): Helene Thibieroz (Synopsys), Scott Little (Intel), Jonathan David (Qualcomm), Richard Shi (Orora Design Technologies), Shayan Farahvash (Maxim Integrated)
- Tuesday, January 29, 2013 | 3:45pm-4:25pmSpeaker(s): Patrick Mannion (UBM Tech, Electronics), Shachi Nandan Kakkar (Cupertino High School), Manan Mehta (Solectria Renewables), Lloyd Walker (San Jose State University), Amanda Pratt (UC Berkeley), Andrew Milluzzi (University of Florida)Track(s): Special Events
- Tuesday, January 29, 2013 | 3:45pm-5:00pmSpeaker(s): Chris Scholz, Ph.D (Rohde & Schwarz)Track(s): Sponsored Training
- Tuesday, January 29, 2013 | 3:45pm-5:00pmSpeaker(s): Craig Wiley (Parade Technologies), Andrew Baldman (University of New Hampshire Inter Operability Laboratory), Mike Engbretson (Granite River Labs), Rick Eads (Agilent Technologies)Track(s): High-Speed Serial Design
- Wednesday
- Wednesday, January 30, 2013 | 8:30am-12:00pmSpeaker(s): Perry Keller (Agilent Technologies), Heidi Barnes (Agilent Technologies), Ai-Lee Kuan (Agilent Technologies), Jennie Grosslight (Agilent Technologies)Track(s): Sponsored Training
- Wednesday, January 30, 2013 | 8:30am-9:10amSpeaker(s): Youngsoo Lee (Samsung Electronics), Dongyoun Yi (Samsung Electronics)
- Wednesday, January 30, 2013 | 8:30am-9:10amSpeaker(s): Jun Fan (Missouri University of Science and Technology), Jingook Kim (UNIST), Dongil Shin (UNIST), Junho Lee (SK Hynix), Chulsoon Hwang (Samsung Electronics), Sunki Cho (SK Hynix)Track(s): Jitter, Crosstalk, and Noise Analysis
- Wednesday, January 30, 2013 | 8:30am-9:10amSpeaker(s): Romi Mayder (Xilinx), Chris Wyland (Xilinx), Bradley Brim (Cadence), Yingxin Sun (Cadence Design Systems)Track(s): System Co-Design: Chip/Package/Board
- Wednesday, January 30, 2013 | 8:30am-9:10amSpeaker(s): Xiaoxia Zhou (Cisco Systems (China) R&D Co.), Hongmei Fan (Cisco Systems (China) R&D Co.), Jing Li (Cisco Systems), Kam Taunk (Cisco Systems), Alpesh Bhobe (Cisco Systems), Jinghan Yu (Cisco Systems (China) R&D Co.), Philippe Sochoux (Cisco Systems)
- Wednesday, January 30, 2013 | 9:20am-10:00amSpeaker(s): Mandy (Ying) Ji (Rambus), Ming Li (Rambus), Julia Cline (Rambus), David Secker (Rambus), Kevin Cai (Rambus), John Lau (Industrial Technology Research Institute Taiwan), Pei-Jer Tzeng (Industrial Technology Research Institute Taiwan), C