PCB Fabrication and Materials
TUESDAY, JANUARY 31, 9AM-6PM
The printed circuit board (PCB) is used in all but the simplest electronic products and is of course familiar to any engineer. If you would like to learn more about the fabrication process and material options in PCB creation, this PCB Fabrication and Materials Boot Camp is for you. Led by Lee Ritchey, one of the industry’s premier authorities on high-speed PCB and systems design, this boot camp will cover PCB laminate manufacture and properties, fabrication, and details of designing PCB stackups for various market segments. Get your pass.
Today’s high-speed PCBs, with their inherent signal integrity and power delivery requirements, make it necessary to employ far more discipline in the choice of materials and the arrangement of layers in the stackup. These requirements are outside the skill set of most PCB fabricators. The objective of this session is to guide the design engineer through the process of evaluating and selecting the right laminate for any given design and then designing a PCB stackup that meets the numerous requirements of a complex, multilayer board that works right the first time.
With the very high data rates being designed into current products, such as PCIe Gen3, 32 Gb/S links and other very fast signaling protocols, it is imperative that design engineers have a good working knowledge of how laminates are manufactured. This has become especially important as designs are prototyped in one place and manufactured in another where the laminates sources can differ greatly.
Because of all these requirements, the design engineer needs to take charge of material selection and the designing the PCB stackup to insure impedance, skew, cross talk and power delivery goals are met.
This session is divided into three parts:
- How laminates are manufactured
- How PCBs are fabricated
- How to design a PCB stackup that optimizes laminate choice and fabrication
Section 1 is a thorough treatment of how laminate is manufactured and what an engineer can expect from each class of laminates.
Section 2 discusses in detail the three methods of laminating printed circuit boards: Cap lamination, foil lamination and build up lamination, and how each fills a particular performance need.
Section 3 is a thorough treatment of PCB stackup design including accounting for weave induced skew and copper surface roughness. This section also includes how to get the necessary electrical specifications (loss tangent, dielectric constant and weave style) needed by the design process as well as impedance calculating tools available for this task.