• Conference
    Jan 30-Feb 1, 2018
  • Expo
    Jan 31-Feb 1, 2018
  • Santa Clara Convention
    Center 
    | Santa Clara, CA
  • 1.0 mm (W) Precision Adapters

    Southwest Microwave’s full range of commercially-priced within-series and between-series 1.0 mm precision adapters feature near-metrology grade performance. Designed to address higher frequencies up to 110 GHz, the adapters successfully and economically address critical production and test requirements and are ideal for use as connector savers without compromising measurement accuracy.

    They are approved for demanding environments such as space or other Hi-Rel applications. Produced and tested to the same criteria as adapters for calibration kits, they provide a cost-effective solution for applications that do not specify phase matching, where previously only expensive metrology-grade adapters were used.

    The array includes F to F, M to M and F to M adapters for interface between 0.9 mm SuperMini and 1.0 mm connectors.

  • 15 Analog FIR Filter

    The ADSANTEC ASNT6171-KMO part is a dual 15-tap FIR filter for processing of two analog signals dip/din and
    dqp/dqn. It includes two passive delay lines with 14 matching sections and three loss-compensating buffers in each one. The buffers feature gain and frequency response adjustment. The signals from all 15 nodes of both delay lines are delivered to 4 summation blocks (ΣT) through taps. Each tap in both delay lines includes two buffers with individually controlled weight and sign.

  • 3M Twin Axial Cable Assemblies

    3M is helping its customers achieve new benchmarks in server performance, density, reliability and cost with our flat, foldable 3M™ Twin Axial Cable. 3M Twin Axial Cables are available in internal and external configurations. It features: 1) Excellent Electrical Performance with high bandwidth (resonance-free beyond 20 GHz) and excellent SCD21 & skew; 2) Thin and Foldable which allows cable to be run through “non useable” space, enables it to be oriented to avoid blocking airflow, and can be folded at very tight bend radii without SI degradation; and 3) Improved Terminations with a ribbon construction that fixes locations of signals and grounds, an efficient termination process with no wire routing errors, and reduced termination variability helps improve reliability.

  • 40G & 100G QSFP AOC Checker

    The QSFP Checker is an instrument which can help you to test QSFP,QSFP+ module ,QSFP AOC,QSFP+ AOC,QSFP DAC,QSFP+ DAC
    It can help you to read the internal memory EEPROM of the modules and display details of the EEPROM (such as the Part Number, Vendor Name, description and range.), monitor all DDM information. You can change the EEPROM if you know the module password . In addition it can measure the power of the module.The QSFP Checker combines the Serial Pattern Generator, Bit Error Rate Analyzer. It provides common transmission rate for 40G and 100G.
    The friendly graphic user interface (GUI) provides clear monitoring for bit error rate, bit error counter, time, status, power of the module, selection of data rate and PRBS pattern.

  • Advanced Cable Tester

    The Total Phase Advanced Cable Tester is the quickest, most convenient and affordable way to test USB Type-C cables. It provides thorough continuity testing and DC resistance measurement for safe operation and reliability, signal integrity testing at the cable’s target speed and E-Marker verification.
    Rapid spot-checking of cables, easy-to-understand results, and comprehensive test coverage are now available to laboratory and production environments at a fraction of the price, setup time and labor versus any alternative solutions.

  • Allegro Sigrity PI Base

    Categories: Design Tools

    The Cadence® Allegro® Sigrity™ PI design and analysis environment streamlines the creation of power delivery networks (PDNs) on high-speed and high-current PCB systems and IC packages. A range of capabilities enable you to explore, optimize, and resolve issues related to electrical performance at all stages of the design cycle. By enabling an electrical constraint-driven design flow, this environment accelerates the time-to-design success while reducing overall cost. The solution integrates tightly with Cadence PCB and IC package layout editors and with Cadence Allegro Design Authoring, enabling front-to-back, constraint-driven PDN design for PCB and IC package design.

    https://www.cadence.com/content/cadence-www/global/en_US/home/tools/ic-p...

  • Altium

    For more than 30 years, Altium has been enabling innovators to design the future of electronics by providing solutions to help them leverage new technologies, efficiently manage projects, and deliver successful products. With the continuous development of innovative design technology, the company empowers engineers to design revolutionary products that move the human experience forward.

  • ANSYS Chip-Package-System Design

    Categories: Design Tools

    Designing Advanced Driver Assistance Systems (ADAS), IoT, 5G and other high-performance digital systems demands simulation well beyond a good circuit simulation tool. Take your designs to the next level with ANSYS to maximize power efficiency and accurately predict electro-thermal behavior and electromagnetic coupling within compact designs. Learn how ANSYS solves complex electronic assemblies and automatically produces transient plots for TDR, eye diagrams, and compliance reports. This, first in the industry, design flow can perform DC analysis, map Joule heating to a mechanical solver, then produce temperature profiles and mechanical deformation and stress. It’s a chip - package - board solution that allows you to evaluate electrical, thermal, and structural behavior enabling your design team to optimize system performance prior to build and test.

  • ANSYS Chip-Package-System Design

    Categories: Design Tools

    Designing Advanced Driver Assistance Systems (ADAS), IoT, 5G and other high-performance digital systems demands simulation well beyond a good circuit simulation tool. Take your designs to the next level with ANSYS to maximize power efficiency and accurately predict electro-thermal behavior and electromagnetic coupling within compact designs. Learn how ANSYS solves complex electronic assemblies and automatically produces transient plots for TDR, eye diagrams, and compliance reports. This, first in the industry, design flow can perform DC analysis, map Joule heating to a mechanical solver, then produce temperature profiles and mechanical deformation and stress. It’s a chip - package - board solution that allows you to evaluate electrical, thermal, and structural behavior enabling your design team to optimize system performance prior to build and test.

  • ApsimSPE-Multi

    Multi-board simulation software solution for Signal Integrity, Power Integrity and EMI. Includes SSO/Jitter analysis, EMI simulation and Power Integrity analysis.

  • Autodesk EAGLE

    Build anything you can imagine with Autodesk EAGLE - the powerful, easy to use PCB design software made for every engineer. Transform your next spark of an idea into reality with easy schematic design, then bring your design to life with advanced PCB layout tools. And with access to the world’s largest supply of ready-to-use parts libraries, you’ll be able to stay focused on your design without any of the typical engineering busywork. Get started with Autodesk EAGLE for free today and connect with a global community of over 4 million like-minded engineers at http://www.autodesk.com/products/eagle/overview.

  • Backplane

    RoBAT manufactures a suite of robotic test products; all dedicated to backplane and linecard test. We offer a range of test functions such as Electrical, Mechanical, AOI, X-ray and High Speed (TDR). Our flagship product is the RCI machine. This machine is capable of performing a TDR test on every high speed net on an entire backplane in a production environment. During 2017 RoBAT will be introducing its next generation RCI machine. This machine will have four independent robotic heads and be capable of automatically testing 100% of the high speed nets on a backplane using a VNA.

  • Cabline-CA II Micro-Coax Wire-to-Board Connector

    Categories: Power and Battery Management ICs, RF ICs, System Boards

    CABLINE®-CA II Micro-Coax Connectors are designed to transfer data rates up to 20 Gbps while providing 360-degree EMI shielding. The unique locking-shielding cover design secures a quiet interconnection. The connectors are 0.4mm pitch and are extremely low profile, making them ideal for use in most electronic devices.

  • CAM350

    CAM350® provides verification, optimization and output generation to efficiently drive PCB fabrication.

  • Coaxial Solderless Compression Mount Connectors

    Categories: RF ICs

    Amphenol SV Microwave manufactures a large variety of solderless precision RF connectors in high-frequency bands including the mmWave frequencies. They offer a variety of cost-effective coaxial PCB-mount SMA, 2.92 mm, and 2.4 mm connector series. Their solderless application makes assembly fast, easy, and without damaging the PCB board.
    Features and Benefits:
    • Fast and easy PCB installation without solder
    • Cost-effective testing solutions
    • Durable rugged stainless steel design
    • SMA, 2.92 mm, and 2.4 mm series available
    • Stripline, microstrip, and coplanar waveguide PCB launch
    • DC to 50 GHz
    Applications:
    • High-speed digital
    • RF test and measurement (wireless chip break-out board)
    • Stripline, microstrip, and coplanar waveguide PCB launch

  • Configurable Lab Buddy

    "Over a million combinations to choose from!"
    ✔ Pick & choose up to ANY FOUR Discovery Semiconductors' products
    ✔ Configure the Lab Buddy anyway you wish.
    ✔ Bring output into your lab environment!

  • Consensia’s innovation management solution – ENOVIA

    Categories: Design Tools

    Our solution, Dassault Systemes ENOVIA PLM, enables high tech companies manage development of multi-disciplinary products in a collaborative environment. Customers manage product development projects/program, requirements, product architecture, CAD design data management (Solidworks, Altium, etc.), product configuration, behavioral simulation, and supplier collaboration with the objective of faster time to market with reduced engineering expenses

  • Contract Manufacturing

    Categories: System Boards

    i3 Electronics is North America's leading designer and manufacturer of advanced, reliable and high-performance electronic solutions, assemblies and systems. i3's Industry Leading Products and Services: Design - Electro, Thermal & Mechanical Modeling; Ultra High End PCBs; Advanced Assembly and Semiconductor Packaging; Flex, Rigid-Flex and 2.5 & 3D Die, and High Speed Back Plane & Press Assembly; Advanced Reliability & Signal Integrity (SI) Labs; System Integration & Test; Design, Prototype & QTA; Advanced R&D Services

  • CrystalBand™

    Bellwethers CrystalBand™ uses a multiple cross contact design that creates connections capable of handling high electrical current in a small space with both low insertion and extraction forces, higher quantity of mating cycles, lower contact resistance, increased current carrying capacity, and minimum temperature rise. CrystalBand™ contact offer significant advantages over other contact designs. The multiple cross contacts in each spring distribute current more evenly, lowering the voltage drop compared to conventional contacts. Based on EIA-364-70 test spec, the amperage of CrystalBand™ can go up to 230A for Bus Bar solution on diameter 3.6mm BTB type connector. CrystalBand™ contacts outperform conventional contacts in the areas of durability (10,000 cycles), lower mating force and lower resistance.

  • Custom Mixed-Signal ASICs

    Categories: RF ICs, SoCs

    We design and supply high-speed Mixed-Signal ASIC solutions that achieve significantly lower cost, higher performance and product differentiation.
    Our Customers are leading OEM and Semiconductor companies in the Wireless, Wireline and IIoT (Industrial Internet of Things) markets.
    Our core expertise is our experienced people who deliver project and supply chain management, Analog-Mixed Signal and RF design, leading high-speed Data Converter Intellectual Property and the ability to architect compelling economic and technical solutions for our customers.
    We are the #1 ranked Mixed-Signal IP provider. We leverage this to deliver low risk solutions, with a faster time to market.
    We deliver ASIC solutions that sense, measure, control and connect their environment.
    S3 Semiconductor Solutions has been delivering ASICs since 1986 and is an ISO9001 certified business.

  • D-Probe

    D-Probe is designed for signal integrity and RF testing. Its strong probe tips are perfect for direct probing of test pads on uneven surfaces and solder bumps. It can perform accurate TDR and S-parameter measurements without the need of nearby ground pads. The rugged D-Probes support 0.4-1.2 mm probe pitches and perform similarly to microprobes up to 20 GHz.

  • DesignInTools.Intel.com

    Categories: Design Tools

    DesignInTools.Intel.com provides many critical tools and services to enable your design of iA based solutions. No-cost PCB design reviews, VR test tools, BIOS validation tools, and many more resources will ensure your successful design and validation activities.

  • DesignInTools.Intel.com

    Categories: Design Tools

    DesignInTools.Intel.com provides many critical tools and services to enable design and validation of Intel based solutions. No-cost PCB design reviews, VR Test Tools, BIOS validation tools, and many other solutions will ensure your successful design and validation activities.

  • Dino-Lite

    Handheld portable USB microscopes used for inspection and quality control. Most models provide 10x-220x magnification, with higher magnification ranges going up to 500x and 900x. The included software has capability to capture images, record videos annotate and perform measurements, and save and email discoveries. The EDGE series contain an enhanced sensor for improved image quality, with features such as Extended Depth of Field (EDOF), Extended Dynamic Range (EDR), and Automatic Magnification Reading (AMR). The 5MP Edge series models are now available, with Flexible LED Control (FLC) for increased versatility.

  • Dino-Lite 5MP Digital microscopes

    Handheld portable USB microscopes used for inspection and quality control. Most models provide 10x-220x magnification, with higher magnification ranges going up to 500x and 900x. The included software has capability to capture images, record videos annotate and perform measurements, and save and email discoveries. The EDGE series contain an enhanced sensor for improved image quality, with features such as Extended Depth of Field (EDOF), Extended Dynamic Range (EDR), and Automatic Magnification Reading (AMR). The 5MP Edge series models are now available, with Flexible LED Control (FLC) for increased versatility.

  • DipTrace

    Categories: Design Tools

    DipTrace is a high-quality PCB design software tool with intuitive interface, multi-sheet and hierarchical schematics, differential pairs, built-in high-speed shape-based autorouter, advanced real-time DRC, connectivity verification, Gerber / GerberX2 / ODB++ manufacturing outputs, and 3D preview with 3D MCAD export. DipTrace means minimum learning curve, low initial cost, no annual fee, and comprehensive support of of designs and libraries of other formats.

  • Eclipse

    The Eclipse is a revolutionary power/signal connector from Positronic, the leader in high current density interconnects. The low-profile Eclipse combines the premium performance of solid, machined power contacts with low-cost, stamped and formed signal contacts. The product is targeted to all types of computing equipment that demand high efficiency power connectors. Founded in 1966, Positronic is a global manufacturer of highly reliable electronic connectors known for distinctive core capabilities, including solid machined contacts with low resistance/high conductivity for use in standard and quick-turn custom connectors. Key products include high power, D-sub, rectangular and circular connectors. Customized solutions are available as well. Positronic is known globally for the unique ability to quickly modify existing designs or create new products to meet application specific needs.

  • Edge Rate® HD

    Edge Rate® HD, Samtec’s new 0.635 mm pitch, high-speed, multi-row strip, packages the same reliable contact system and ease of processing found in the SEARAY™ family, in an even smaller and higher-density strip design. With both the two-row (2.5 mm wide) and four-row (5 mm wide) versions capable of supporting 28+ Gbps applications, as well as multiple next-generation protocols, Edge Rate® HD (EDM6/EDF6 Series) is the future of high-speed strips at Samtec, and in the industry.

  • ELCON Mini

    ELCON Mini provides confidence in system performance with their low resistance, highly reliable interface. Features include positive metal latch retention, optional coding contacts for sense/detect functionality, enhanced grounding, use of industry-proven crimp contacts and excellent price to performance ratio.

  • EMC Shielding Solutions

    Harwin's range of EMC Board-Level Shielding offers SMT solutions on tape and reel ready for automated placement. Shield clips allow for Shield Cans to be easily secured without soldering, improving signal integrity by eliminating through-holes that interfere with the ground plane.
    Nickel Silver Shield Cans eliminate hot spots and are easily removable and replaceable for rework and cleaning purposes. Single-piece construction saves costs over fence-and-lid cans.
    A wide range of Spring Contacts are suitable for shielding and grounding applications. For use on surface mount PCBs in contact with metal shields or frames. Suitable for both wiping and sliding actions.

  • EMxpert

    EMxpert is a real-time, compact, bench-top EMC/EMI diagnostic tool enabling designers to rapidly diagnose & solve EMC/EMI problems in a single design cycle. Gain insights about why designs fail something no chamber can give you. No more waiting for chamber time to redesign & test by trial & error. The EMxpert rapidly diagnoses even intermittent problems, which may go undetected when using handheld and automated probes.
    EMxpert is 1/10th of a chamber’s cost and operate 100 times faster.
    * Fast PCB emission testing
    * High resolution 0.1 mm
    * 150 kHz to 8 GHz

  • ExaMAX

    Amphenol FCI's beam-on-beam contact interface has enabled new backplane connector solutions for high bandwidth applications. ExaMAX optimizes design flexibility by integrating high-speed differential signals. It comes in 2mm and 3mm pitches, 12-96 differential pairs, and is offered in both 95Ω and 92Ω versions, with standard packaging options including: traditional backplane, coplanar board, inverse coplanar board, orthogonal midplane, orthogonal direct mate, mezzanine, and cable-to-board.

  • ExaMAX®

    ExaMAX® high-speed backplane system (EBTM/EBTF-RA Series) enables 28 Gbps performance on a 2.00 mm column pitch and 56 Gbps on a 3.00 mm column pitch. This rugged system has the industry’s lowest mating force with excellent normal force, a 2.4 mm contact wipe and two points of contact for high reliability. Among other industry specifications, ExaMAX® exceeds OIF CEI-28G-LR for 28 Gbps standards and meets Telcordia GR-1217 CORE specification. The roadmap for ExaMAX® products is robust, including cable, direct mate orthogonal, mid-plane orthogonal and coplanar.

  • FireFly™

    Samtec’s x4 duplex 28 Gbps FireFly™ optical engine (ECUO Series) brings its industry-leading density to the 100 Gbps Datacom/Telecom and HPC markets. Designed with thermal optimization in mind, options are available for both forced air and cold plate cooling scenarios. The integral dual-band CDR was designed to work with the latest Ethernet and InfiniBand™ protocol specifications. This x4 duplex architecture makes FireFly™ ideal for communications within a rack, or between racks, all while offering an extremely small footprint on the board.

  • Flyover QSFP28 Cable Assembly

    Samtec’s flyover QSFP28 cable assembly (FQSFP Series) achieves 28 Gbps performance and is backward compatible with all QSFP assemblies. This direct attach system allows drivers to be remotely located for design flexibility and greater control over thermal cooling, with press-fit tails that provide low speed signals and power to the PCB. Signal integrity is optimized by flying critical data over lossy PCB via Samtec’s ultra-low skew pair twinax cable with inherently lower attenuation. Re-timers are not required, reducing cost and power consumption.

  • GaugeChanger

    Spectra7’s GaugeChanger is the first of it’s kind. Our technology enables interconnects to run at next-generation data rates of 28Gb/s while decreasing the OD of the cable. We’ve taken a 4x28G QSFP cable and miniaturized it with our gauge-changing technology so installers and technicians are easily able to route these interconnects efficiently and without any mess.

  • GENESYS PROGRAMMABLE POWER SUPPLIES

    TDK-Lambda Americas High Power Division is a manufacturer of Programmable, High Density Power Supplies located in Neptune, N.J..and has been in business for more than 50 years. We employ approximately 200 employees.

    TDK-Lambda Genesys™ Series of Programmable Power Supplies has the highest density, making the Genesys™ Series the most complete set of platforms with identical user interfaces . Platforms include 750W, 1500W, 2400W, 3.3/5kW and 10/15kW Output. Outputs available range up to 1,500V and 1,000A. In addition to saving space, GenesysTM power supplies contain extensive standard features that provide a new level of performance and flexibility. Interface options include LXI Certified LAN interface, IEEE, USB, and Isolated Analog which provide flexible system integration and functionality.

  • GRL USB Type-C Power Delivery Solution

    GRL-USB-PD, the world’s first oscilloscope-based software designed for testing to the USB Power Delivery (USB PD) specification. GRL-USB-PD software, when used on any Windows 7+ oscilloscope, provides a simple and efficient way to perform USB PD electrical parametric and protocol measurements. Combined with the GRL-USB-PD-C1 hardware, GRL-USB-PD provides a complete, automated solution for enabling USB Power Delivery product validation. GRL-USB-PD-C1 hardware provides an essential analysis tool for the design, debug, and validation of any USB Power Delivery or USB Type-C design.

  • GTL 5050 Probing Platform

    The GTL-5050 Probing System is the industry standard for probing mutliple-board-interconnects, BGAs, test sockets, contactors, PCBs, and back-planes.

  • HDO9000 / HDO9000-MS High Definition Oscilloscopes

    Categories: Debugging Software Tools

    The HDO9000 with HD1024 Technology provides exceptional signal fidelity with 10-bit resolution, 4 GHz bandwidth and a superior oscilloscope experience to deliver faster time to insight.

  • HDO9000 / HDO9000-MS High Definition Oscilloscopes

    Categories: Debugging Software Tools

    The HDO9000 with HD1024 Technology provides exceptional signal fidelity with 10-bit resolution, 4 GHz bandwidth and a superior oscilloscope experience to deliver faster time to insight.

  • Hercules® Active Optical Module (AOM) Connector System

    Hercules® VITA 76 approved ANSI ratified utilizes 38999 ecosystem organized in differential pairs. New AOM in Shell Size 17 extends temp range (-40 to +85C) w/Reflex Photonics® tranceiver. Unlike other media convectors that use slow pin & socket copper interfaces, Hercules AOM is fully functional as a full 40Gig Ethernet module while maintaining its protocol agnostics, thereby giving system integrators flexibility to choose either copper cable or AOM sans mods to systems' electrical or mechanical design. Once integrated, AOM may be replaced w/o removal of adjoining boxes or fiber optic cable resulting in shorter down time in systems w/long life expectancy. Weighing only 3.5oz & measuring 3", AOM draws only .8W & removes heat dissipation to outside of box. Interfaces w/single bay MT size 11 connector customizable on far end to meet app-specific requirements for other fiber interfaces.

  • Hercules® High-speed D-Sub (HS-D)

    Meritec is featuring its VITA 76.0 ANSI-approved Hercules® 38999 High-Speed interface now embedded in (HS-D) D-Sub rugged-rectangular MIL-DTL-24308 shell providing high-bandwidth, high-pin count and durability suitable for Mil/Aero & rugged commercial applications not previously accommodated by industry-standard connectors. Celebrating 50 years of solving unique & difficult interconnect problems--from point-to-point continuity to ultra-high bandwidth solutions in a variety of environments.

  • HFWorks

    Categories: Design Tools

    HFWorks is SolidWorks-embedded EDA design tool based on the powerful finite element method. If you are product involves Signal Integrity, Power Integrity, Battery Management ICs, RF ICs, RF MEMS, Power Supply, Power Management, or Electronic Components in General, HFWorks is your indispensable EDA design tool. It is equally embedded in and ANSYS SpaceClaim. With such a powerful tool at your disposal, you will be able to: • Construct complex 3D models in record time. • Import designs in a wide range of popular CAD formats. • Exploit advanced visualization and rendering technologies that bring unprecedented realism to your models. • Generate engineering drawings and CAM-ready files quickly and automatically and share your designs with your mechanical engineers. • Shorten product design time and lower design cost.

  • Hi-Performance Microwave Probes

    Gigatest Labs developed the GTL65_Series and GTL40_Series of microwave probes to solve the recurring problem engineers experience with probe tip breakage when contacting non-planar PCB surfaces. The optimized design of the GTL65 and 40_Series Microwave probes provides the durability, contact compliance, and long-life span for day-to-day engineering measurement tasks.

  • HSIO

    HSIO Technologies new line of Zero Footprint Sockets incorporates a device size socket footprint with industry standard spring pins. These small test sockets allow a customer to place them into any end application allowing a Spring Pin socket to be directly re-flowed into the same location as the device. HSIO can design a socket to work with any type IC packages; BGA- LGA - QFN- DFN and even leaded devices.Using industry standard spring pins HSIO can design these sockets to the best high speed electrical and mechanical life requirements you need for your application.

  • Huntron Access Robotic Test Station

    The Access Prober is designed to accurately access test points on small to medium sized PCAs. The exceptional accuracy achieved by micro-stepping and linear encoding ensures reliable probing of the smallest surface mounted components

  • I-PEX FPL-10 Coaxial Wire-to-Board System

    Categories: Power and Battery Management ICs, RF ICs, System Boards

    The I-PEX FPL-10 is a high-speed differential coaxial wire-to-board connector system, ideal for the performance and mechanical demands of Enterprise Computing equipment. The FPL-10 system delivers exceptional signal integrity for critical data links. The differentially-driven coaxial wires result in a very small and flexible bundle that makes for easy routing and installation. The system includes end latches on the boardmount half that automatically engage during assembly insertion. The FPL-10 is capable of data rates of 25 Gbps and offers low insertion loss, low SCD21, and excellent cross talk management. The low profile connectors and tight cable bundles present minimal obstruction to air flow.

  • ISD

    Categories: Debugging Software Tools, Design Tools, System Boards

    In-Situ De-embedding (ISD) is a unique de-embedding tool invented by AtaiTec to avoid non-causality and accurately extract DUT's insertion loss, return loss, NEXT and FEXT to 50+ GHz.

  • ITEQ Copper Clad Materials

    Copper clad product line ranging from standard loss to ultra low loss including both lead free and halogen free materials.

  • Jaguar XT5

    Categories: System Boards

    Pumping out a sustained 1.64 quadrillion mathematical calculations per second (1.64 petaflops) after a recent technological overhaul, the Cray XT Jaguar is now the world's latest fastest supercomputer (huge disclaimer coming) for non-classified research. And once you see what's under the hood, you'll know why.The system is powered by 45,000 quad-core AMD Opteron processors that take advantage of 362 terabytes of memory. This and other underlaying architecture allows processors to chew on 284 gigabytes of data per second with its impressive I/O bandwidth, which has apparently been a major bottleneck in supercomputers of yesteryear. Information is stored on 750 terabytes of hard drives. The Cray XT Jaguar can be found at the Department of Energy's Oak Ridge National Laboratory where it will create scientific breakthroughs during the day, and succumb to Crysis at night.

  • LabMaster 10-100Zi 100 GHz Oscilloscope

    Categories: Debugging Software Tools

    The LabMaster 10-100Zi real-time oscilloscope boasts the world’s highest bandwidth and fastest sampling rate. This world-leading performance is key to analyzing and understanding the fastest phenomena found in R&D labs where engineers and scientists are working on next-generation communication systems, high-bandwidth electrical components, and fundamental scientific research.

  • LabMaster 10-100Zi 100 GHz Oscilloscope

    Categories: Debugging Software Tools

    The LabMaster 10-100Zi real-time oscilloscope boasts the world’s highest bandwidth and fastest sampling rate. This world-leading performance is key to analyzing and understanding the fastest phenomena found in R&D labs where engineers and scientists are working on next-generation communication systems, high-bandwidth electrical components, and fundamental scientific research.

  • M8040A 64 GBaud High-performance BERT

    The Keysight M8040A is a highly integrated BERT for physical layer characterization and compliance testing. With support for PAM-4 and NRZ signals and data rates up to 64 GBaud (corresponds to 128 Gbit/s) it covers all flavors of 200 and 400 GbE standards.

    The M8040A BERT offers true error analysis and provides repeatable and accurate results optimizing the performance margins of your 400GbE devices.

    The M8040A is designed for R&D and test engineers who characterize chips, devices, transceiver modules and sub-components, boards and systems with serial I/O ports operating with data rates up to 32 GBaud and 64 GBaud in the data center and communications industry.

  • Measurement & Modeling Services

    Gigatest Labs pioneered the use of RF and microwave measurement techniques for SI applications. Today, our engineering expertise includes Agilent Technologies ADS suite of modeling and simuplation tools, CST 3-D simulation tools, and lab measurements, differentially, and single-ended, to 67GHz.

  • MEGTORN7

    1. Ultra-low transmission loss
     -R-5785:Dk=3.6, Df=0.003(12GHz)
     -R-5785(N):Dk=3.4, Df=0.002(12GHz)
    2. High heat resistance and reliability (equivalent to MEGTRON6)
    3. Compatible with lead-free soldering

  • microQSFP

    microQSFP provides QSFP28 functionality in a smaller, generally SFP-sized form factor, all while providing significantly better thermal performance to save energy costs, improved electrical performance at 25 Gbps NRZ / 56 Gbps PAM-4 and 33% higher density than QSFP to fit more ports on a standard line card.

  • MIPI CD-PHY Analyzer

    Categories: Debugging Software Tools

    The Introspect MIPI CD-PHY Analyzer is a portable, high-performance instrument for understanding and validating C- and D-PHY transmitter ports. Capable of analyzing any traffic and being completely data-rate agile for both PHYs, the Analyzer also includes complete hardware de-mapping and decoding of the C-PHY three-wire signaling. New for 2017 is Protocol Analysis for DSI-2 and CSI-2. Sophisticated capture and analyze tools provide the ability to view every frame, decode packet details and locate errors. Raw event tables and time stamps allow you to correlate individual lane events to errors in final, merged traffic. The Introspect Analyzer is compliant to the latest MIPI Physical- and Protocol-Layer standards and will make an immediate and lasting impact on your product development cycle. Pair with an Introspect Generator and your lab is equipped to exercise and analyze any link.

  • MoSys® LineSpeed™ Flex 100G PHY ICs

    MoSys® LineSpeed™ 100G gearbox and retimer ICs are optimized for high signal integrity and provide flexible long-reach or short-reach electrical connectivity to optics, passive cables or backplanes. In addition to its SerDes PHY ICs, MoSys’ LineSpeed 100G Low Power Octal CDR features advanced test capabilities and ultra low power for QSFP28, CFP4, or CFP2 modules. The newest device, the LineSpeed Flex 2:1 MUX, is a flexible SerDes device that bit interleaves protocol-independent data rates ranging from 10-14G into a single stream at 2 times the rate, supporting multiple protocols and consolidate bandwidth. MoSys products enable leading Cloud, networking, communications, and data center systems OEMs to address the continual increase in Internet users, data and services.

  • Multi-site cartridge based IC test sockets

    Reduce errors in device handling by loading DUTs into a multi-site cartridge carrier test socket that travels across all stages of test without having to load or unload the DUT between tests. Ideal for OEM's, RTI's cartridge test sockets can reduce your overall cost of test from prototype through production and at any stage in between. This custom solution is available for all IC packaged devices and allows you to test devices in prototyping/engineering, qualification, burn-in, HAST, ATE production, programming, failure analysis, and more without the need to transfer or even touch each DUT along the way.

  • Multilane Time Domain Analyzer (TDA)

    Twin 30 Gb/s channel BERT, one channel accommodates jitter injection. Also includes a 32 Ghz CDR Sampling Scope

  • Octopart

    Octopart is a search engine for electronic parts.
    Search across hundreds of distributors
    and thousands of manufacturers.

  • OSFP

    The OSFP is a new pluggable form factor with eight high speed electrical lanes that will initially support 400 Gbps (8x50G). It supports 32 OSFP ports per 1U front panel, enabling 12.8 Tbps per 1U. It has an integrated heat-sink that greatly improves thermal performance and enables modules with up to 15W power in a switch chassis with conventional airflow. The enhanced thermal performance and higher power capacity allow the OSFP to support a wide range of optical protocols. The multisource agreement is in the final stages of ratification - visit osfpmsa.org/ for more information.

  • Paladin™

    Exhibiting smooth linear transmission beyond 40GHz, and the lowest crosstalk in the market, Paladin™ sets the benchmark for signal integrity performance in backplane interconnects to support today's interconnect speed with headroom for tomorrows performance requirements.  Designed for scalability and flexibility through the use of a simplified connector construction, Paladin™ also offers the broadest product platform in the industry.  With traditional backplane, cable backplane, over 100 direct orthogonal configurations possible, and consistent SI performance over it's entire mating range, Paladin™ is able to support any system architect's needs.

  • Paladin™

    Exhibiting smooth linear transmission beyond 40GHz, and the lowest crosstalk in the market, Paladin™ sets the benchmark for signal integrity performance in backplane interconnects to support today's interconnect speed with headroom for tomorrows performance requirements.  Designed for scalability and flexibility through the use of a simplified connector construction, Paladin™ also offers the broadest product platform in the industry.  With traditional backplane, cable backplane, over 100 direct orthogonal configurations possible, and consistent SI performance over it's entire mating range, Paladin™ is able to support any system architect's needs.

  • PalPilot PCB, Components, Engineering Services

    Categories: System Boards

    Sales Force Driven: 146 Sales Representatives // Engineering Forward: Local Design/Engineering, FAE Support, SI/PI, Measurement, Mechanical Engineering // Component Supply Chain: PCB & Substrate, Connector & Cable, Mechanical Parts

  • PCB Droid

    PCB Droid is the first and only PCB designer application on mobile devices. It utilizes an easy to use, WYSIWYG (What You See Is What You Get) editor with a UI familiar to most of the market. You can thing of it as an advanced sketchbook for both hobbyists and professionals, which let’s the user create industrial quality material anytime, anywhere. Our cloud services ensure that our users will always have their work with them. We provide server-based export to industrial standard Gerber format which enables the user to materialize their work while bypassing the limited computing capabilities of their devices.

  • PCB(Printed Ciucuit Board)

    Suntak’s PCB products range from 2 to 50 layers, HDI,Heavy Copper, Rigid-Flex, and Embedded Capacitance, and provides "PCB One-stop Shop" service to meet customers’ diverse demands.
    Our products are widely applied in communication, industrial control, power electronics, medical instrument, security electronics, aerospace and so on. 80% of them are exported to America, Europe and other Asia.

  • PCBeam Interposers

    PCBeam connectors from Neoconix offer best-in-class customization for the ultimate in design flexibility. Available with an ultra-low thickness of 0.28mm all the way up to 4mm (and anywhere between), and with an area-array density down to 0.74mm pitch, these connectors can accommodate the most demanding of space constraints.
    Standard product series include SPH1 (for high speed), LPM (low profile), and LPS (low profile solderable). From these, there are virtually unlimited customization possibilities. PCBeam connectors have an excellent reliability record with 10 years of field use and over 1 billion contacts shipped.
    The new DLBeam™ series of
    PCBeam connectors has been developed to enhance signal integrity for applications >28Gbps. The new FPConnected™ products incorporate Neoconix’s connector technologies into advanced flexible circuits for integrated FPC-Connector assemblies.

  • PollEx DFE

    PollEx DFE is rule-based PCB verification software for hardware engineers. Using PollEx PCB as its basis PollEx DFE supports PCB design data in various ECAD formats. It allows users to detect design errors which result in costly electrical defects.

  • PollEx PCB

    PollEx PCB allows users to view all PCB design objects in detail. PollEx PCB quickly reads entire PCB design data and provides users with convenient ways to explore the design details. Its flexible and intuitive GUIs allow users to easily view and modify ECAD files in various formats.

  • PollEx PCB DFE

    - User-optimized environment for setting multiple rules. - Contains all intelligent information from ECAD database with the use of PollEx PCB. - Analyzes electrical problems on PCB design before electrical analysis tools are employed. - Provides customized functions of reflecting requirements of field engineers. - Can manage checking history as report with screenshots of real error points. - Efficient use of Running Core and Pre/Post Processors.

  • PollEx PCB DFE

    PollEx DFE is rule-based PCB verification software for electrical engineers. It consists of Pre-Processor, Running Core, and Post-Processor. Pre-Processor is used for setting input parameters. Users can define rules or classify and register groups or classes for nets and components. Running Core checks the rules against PCB design data. Finally Post-Processor is employed for reviewing the checked results.

  • Printed Circuit Boards

    Streamline Circuits is a leading manufacturer of high quality Printed Circuit Boards
    offering Rigid, Rigid-Flex and Multilayer Flex. We pride ourselves in the expertise to build 2 - 70 layer Rigid PCB, or a 2 - 30 layer Flex PCB. With 40+ materials in house, the most cutting edge equipment in the industry, and a mangement team of industry rockstars, our PCB technology is at the top of domestic manufacturers. Streamline Services: communications, military & aerospace, industrial electronics, instrumentation and medical equipment markets, who need to get their quality products to market first.

  • Printed Circuit Boards

    Categories: Design Tools, System Boards

    APCT is a leading manufacturer of high reliability, rigid printed circuit boards. APCT provides a Broad Range of Technologies, including advanced & emerging HDI work, fabricated at superior turnaround times. Our 2 factory locations are in Santa Clara, California & Wallingford, Connecticut. We are set up to build your proto-type runs and have the ability to manage your production programs through our off-shore partnerships. The difference maker is our people. They give us the ability to say “Yes” to our customer’s demands of Technology & Lead Time. They work within the 3 pillars of our company: Passion, Commitment & Trust. Give us the opportunity to earn your trust and gain your loyalty.

  • Printed Circuit Boards and PCB Assembly

    Categories: RF ICs, System Boards

    Since 1985, Imagineering, Inc. has been a pioneer in the electronic industry for Printed Circuit Boards and PCB Assembly from Prototype to production. Capable of serving the Aerospace Industry under AS9100c Certification as well as commercial and consumer electronics under ISO9001:2008.

  • Probing Systems

    Gigatest Labs probing systems are the industry standard for probing multiple-board-interconnects, BGAs, Test Sockets, Contactors, PCBs,and backplanes. We also offer customization of our probing systems to meet unique customer requirements

  • Promira Serial Platform

    The newly released Promira™ Serial Platform from Total Phase offers many benefits over previous generation host adapters: blazing fast I2C and SPI programming; integrated level shifting; high-Speed USB and Ethernet connectivity; a total of 200 mA of power to your project; and an all new architecture enabling applications download.

  • RCx

    RCx is designed specifically for rack-based interconnect solutions providing simple, low cost, low power options for 25/50/100 Gbps connectivity. RCx is a passive, copper only, modular and high-density cabling scheme for servers and network switches. There are three RCx configurations – RCx1, RCx2 and RCx4, providing 25 Gbps (25Gx1), 50 Gbps (25Gx2) and 100 Gbps (25Gx4) connectivity, respectively. The streamlined RCx design eliminates the need for costly active electrical components like EEPROMs, optics, re-timers, and management ICs; simplifies the electrical design of switches and adapters; and significantly reduces the cost of the overall system solution. The RCx MSA is led by four industry-leading companies: Amphenol, Broadcom, Dell and Hewlett Packard Enterprise.

  • RF Probing in a Box

    The most flexible benchtop station for probing with both ruggedized RF probes and microprobes. It comprises the S-Probes, TCS60 calibration substrate, TP250 precision positioners, PCB holders, microscope and FP40 flex positioner. A user can easily configure the probe station to probe RF PCBs in in minutes.

  • Signal Integrity Software

    Categories: Design Tools

    Xpeedic high speed signal integrity (SI) solution provide a fast and accurate way to enable engineers to simulate the high speed channel for both pre-layout and post-layout scenarios with great confidence.

  • Sigrity SystemSI Technology

    Categories: Design Tools

    Cadence® Sigrity™ SystemSI™ signal integrity (SI) solutions provide a comprehensive and flexible SI analysis environment for accurately assessing high-speed, chip-to-chip system designs. A block-based editor makes it easy to get started. The solutions support industry-standard model formats and automatically connect the models. With a unique combination of frequency domain, time domain, and statistical analysis techniques, you can be confident of achieving robust parallel bus and serial link interface implementations such as PCIe® 4.0 and PAM4 signaling. Use Sigrity SystemSI technology to perform detailed SI analysis of high-speed parallel buses and serial links.

    https://www.cadence.com/content/cadence-www/global/en_US/home/tools/ic-p...

  • Simbeor THz - Electromagnetic Signal Integrity Software

    Categories: Design Tools

    Simbeor THz is two-time DesignVision award-winning electromagnetic signal integrity software for physical design of PCB and packaging interconnects operating at extreme data rates. Simbeor THz is accurate, productive and cost-effective solution for pre and post layout de-compositional analysis of interconnects with 3D full-wave models. Accuracy of the analysis in Simbeor is formally and independently validated with measurements. Simbeor THz provides unique systematic approach to the interconnect analysis that starts from dielectric and conductor roughness model identification and guaranties the analysis to measurement correlation at the end. For more information and to download Simbeor THz, visit Simberian’s web site www.simberian.com.

  • SlimChroma™

    Bellwethers SlimChroma™ is a sleek strip of fully moldable ultra-slender cable that sets a new precedence in the high speed cable arena surpassing all existing standards set by the 40AWG Micro Coax. Offered in many pitch solutions, and whipping out current ratings of 1.1A per pin, it’s designed to fully replace the micro coax on all frontiers, it is a full-blown high speed cable solution. SlimChroma™ is a complete breakthrough in RFI interference and cost-efficiency. A tried and tested advantage for flawless air control, it stands undivided over a multitude of applications and platforms including jumper wire and direct connectivity for all I/O port applications.

  • Sliver Internal Cable Interconnects

    Sliver is TE's new internal cabled interconnect solution that lowers overall costs and improves signal performance by eliminating; 1) re-timers required due to lossy PCB materials; 2) more costly, lower loss PCB materials; and 3) complex board-to-board PCB signal routing.

  • Sockets for High Speed Applications

    BGA sockets and QFN sockets using GT contact technology provide >75GHz signal speed in a smallest footprint for prototype and test applications. These sockets support pitches from 0.3mm to 1.27mm.
    Ironwood's GT sockets are ideal for prototyping and testing almost any BGA or QFN device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 75GHz) and supports BGA or QFN packages with pitches down to 0.3mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).

  • Solder Free Ribbon Cable to Board Connector

    Paricon Introduces Solder Free, Separable, High Performance Ribbon Cable to Board Connector Family

    Paricon has developed a ribbon cable to board connector system that introduces minimal signal degradation between the cable and the PWB. Assembly is solder free and the wire preparation is performed by stripping and bending the wires using standard tooling. Features are provided to assure alignment of the wires with the traces on the PWB. An incorporated molded strain relief retains the ribbon cable to the connector body. The capability can be applied to a wide range of ribbon geometries. The PariPoser® contact is used to assure a reliable interface between the ribbon cable wires and the board traces.

    Specifications
    * Solder Free Assembly
    * High Bandwidth (>80GHz)
    * Low RF Loss (<0.3db @ 40GHz)
    * Low Profile (4.8 mm)
    * Low Interface Resistance (<10 milliohms)

  • SOMACIS

    Categories: System Boards

    High Technology Printed Circuits www.somacis.com

  • Sonnet Suites

    Categories: Design Tools

    Sonnet Software maintains a single, dedicated focus on providing engineers all around the world with the capability and precision needed for their advanced circuit design. As the industry's leading high frequency electromagnetic (EM) software tool for planar circuit analysis, Sonnet utilizes the Shielded Domain Method of Moments technique to provide model extraction error frequently on the order of 1% or less. Sonnet offers high-accuracy analysis of predominantly planar (3D planar) circuits, interconnects in applications including RFIC, MMIC, and high density packaging applications, and handles kHz through THz frequencies. Sonnet Suites Release 16 features new integration with the Modelithics® CLR Library for Sonnet, speed increases in larger projects, and additional new features that give users more control and automation.

  • SPIPro

    Categories: Design Tools, SoCs, System Boards

    SPIPro is SPISim's flag ship product with our complete SI/PI analysis, modeling capabilities and simulator functions.
    Application Scopes:
    *) For extracting nets from post-layout to view/simulate interactively or doing what-if;
    *) For free-form schematic channel building to simulate or doing what-if analysis;
    *) For general purpose TD/FD simulation waveform viewing, measurement and analysis;
    *) For comprehensive S-parameter and Transmission line model data viewing and analysis;
    *) For IBIS V3.2 ~ V5.0, IBIS-AMI modeling, analysis and reporting;
    *) For DOE/RSM/ANN etc analysis flow, modeling and optimization;
    *) For model’s what-if analysis and package de-pop analysis;
    *) For DDR simulation waveform processing to extract JEDEC Spec. parameters;
    *) To simulate in TD, FD or S-parameter extraction;
    *) Can enhance with additional capabilities through additional add-ons.

  • Splitter cable systems

    As an enhancement of its product portfolio comprising high-speed data cables as well as an in-house board and connector design for ‘high-speed products’, Leoni now also provides splitter cable systems that are used in large data centres. These involve assembled copper cables where the three cable ends are (in contrast to breakout systems) based on QSFP1 connector technology. Breakout systems may, on the other hand, consist of various technologies (e.g. SFP, CXP).

  • SSA3000X

    * SSA3021X Spectrum Analyzer (9 KHz - 2.1 GHz) * SSA3032X Spectrum Analyzer (9 KHz - 3.2 GHz)

  • SSA3000X

    Spectrum Analyzer Family

  • State-of-the art system-on-chip technology

    Categories: SoCs

    Socionext Inc., a leader in state-of-the art system-on-chip technology, will feature its high performance SoC designs and advanced packaging solutions at Booth 1239.

    Socionext will showcase its energy-efficient 28nm 56Gb/s CMOS transceiver operating at TX: 1.87 and RX: 2:53 mW/Gb/s compared with other market leaders running at higher power for 20/40/65nm designs.

    The company will also feature its new ARM-based multi-core processor for low-power, scalable, distributed computing server system as well as advanced “Chip-Package-PCB co-design” methodology to help companies cost-effectively meet today’s performance, functionality and time-to-market design requirements.

    Mentor Graphics and Socionext will jointly deliver a technical presentation on Advanced I/O Interface Design for Memory and 2.5D/3D/SiP Integrations. Please refer to the conference program for details.

  • Summit T416 Analyzer

    Categories: Debugging Software Tools

    The Summit T416 is Teledyne LeCroy's latest generation of protocol analyzers targeted at high speed PCI Express 4.0 I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.

  • Summit T416 Analyzer

    Categories: Debugging Software Tools

    The Summit T416 is Teledyne LeCroy's latest generation of protocol analyzers targeted at high speed PCI Express 4.0 I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.

  • SuperButton® Technology

    Continuous wire spring structure supported by elastomer Excellent choice for high current, high frequency, and high density applications for mezzanine level, board-to-board, board-to-flex, and package-to-board (LGA, BGA, etc.) interconnect requirements Preferred solution of interconnect environments constrained by space and force limitations Provides an electrically efficient connection and consistent resistance value from pin to pin Redundant contact points SuperButton® technology delivers cost reduction with enhanced performance for any standard, non-standard footprint with varied, asymmetric and irregular pitches

  • SuperSpring® Technology

    High strength bi-metal spring structure Scalable interconnect technology that provides engineers a reliable and durable drop-in replacement for other connector technologies in low pitch applications that require large compliance at low force SuperSpring® behaves elastically with stable resistance over a large working range Excellent choice for very low pitch, high pin count applications for board-to-board, board-to-flex, and package-to-board (LGA, BGA, etc.) interconnect requirements

  • TB110 Series

    SL Power’s TB110 Series ac/dc power supply models offer up to 90 percent efficiency and a compact form factor. The TB110 models are the perfect choice when high efficiency, superior electromagnetic interference (EMI) protection and electromagnetic compatibility (EMC) performance are required. Featuring:

    • Full EMC protection by meeting the highest levels of EN61000-4-x standards;
    • Greater than 15-year e-cap life at 40°C ambient operating conditions;
    • Greater than 1,000,000 hours MTBF calculated at 50°C;
    • Small 2.0” x 4.0” x 1.4” size, ideal for 1U chassis applications;
    • Up to 110 watts of output power with airflow or 80 watts when convection cooled;
    • Class B conducted EMI with 6db margin and Class B Radiated EMI with 3db margin;
    • 5Vdc at 1A Standby Output;
    • Universal input of 90 to 264 Vac
    • 12V, 24V and 48V outputs
    • Approved to ITE standards of CSA/EN/IEC/UL60950-1

  • TCR(R) Thin Film Embedded Resistor copper foil

    Ticer Technologies manufactures TCR(R) Thin Film Embedded Resistor copper foil used to replace SMT's in RF and digital applications. Embedded within layers of a pwb, TCR resistors allow designers to open board surface area for more or larger active devices to improve functionality and electrical performance.

  • TOYO EMC Total Solutions

    TOYO provides “EMC Total Solutions” from design to EMC test.

    TOYO EMC test software has a strong capability of debugging and trouble-shooting such as 3D radiation display and water fall display. TOYO G-Cell is an inexpensive and space saver solution for EMI pre-scan.

    EMIStream has an EMI design rule check and plane resonance analysis simulation software. EMIStream also has a far-field approximation as well as ESD rule checker.

    EM-ISight is a high-resolution EMI scanner robot which has a far-field approximation algorithm and capable of measuring up to 80GHz. EM-ISight also has a capability of ESD testing.

    Junkosha provides a high-frequency low loss coax cables with higher reliability.

    Risho offers low-loss, low-CTE, low-modulus and high thermal conductivity PCB materials.

  • TP250 Precision Positioner

    A positioner with high-precision XYZ-stage, large turning screws, magnetic base, and versatile probe arm. It can hold microprobes and PacketMicro's own S-Probes and D-Probes. It is good for wafer probing and PCB probing with most competitive price in the industry.

  • USB3.1 Type-C Test Solution

    HUWIN introduces a new USB 3.1 Type-C test solution. It contains test fixtures and a compliance test software. The test fixtures have been optimally designed to measure any USB 3.1 Type-C connectors using a commercial network analyzer. Furthermore, electrical characteristics of the test fixture, affecting to measured results of the connector, have also been minimized by an effort of a high skilled engineer. The dedicated compliance test software supports a high accurate de-embedding function (patent owned) for analyzing the performance of the connectors more precisely. The TDR and S-parameter analysis engines facilitate a verification of the USB 3.1 SuperSpeed+ standard specification.

  • Valydate VERA

    Categories: Debugging Software Tools, Design Tools

    Valydate VERA is a powerful and unique schematic review CAD tool that automates the connectivity checks of every pin on a circuit boards for design errors and marginalities. VERA fully inspects 100% of the nets on a schematic using pre-defined checks and an extensive intelligent model component library. Ultimately, VERA saves board re-spins, shortens time-to-market, and decreases field returns, all of which yields increased profits for clients.

  • Variable ISI Channel - CLE1000 Series

    Applied with Artek's unique technology for analog / mixed signal and advanced electro-magnetics, the CLE1000 is designed as a variable Inter-Symbol-Interference (ISI) channel for high speed serial interface stress tests. It controls the insertion loss continuously at 0.1% step (1,000 steps) in its dynamic range for fine adjustment. The differential transmission lines are totally passive and DC coupled. The adjusted insertion loss amount is reliably repeatable and stable for secure test results. The control is done by the volume dial on the front panel and/or PC remote via USB for automated calibration. Three (3) models of different loss range are prepared to cover various data rates. 4ch versions are also available. The CLE1000 is a convenient ISI channel, applicable for various standard stress tests and compliance tests.

  • VEGA DAC4 Application Systems

    Since 1991, Micram has been a pioneering leader in ultrafast bipolar silicon. Over a dozen Micram devices have set world records for speed and bandwidth. Now Micram UltraFastSiGe™ technology once again delivers the most powerful DAC available, Micram VEGA DAC4. Micram’s single, dual and quad channel signal generation platforms deliver extraordinary performance for developers on the cutting edge. With maximum sample rates >100 GS/s, 35 GHz analog bandwidth and ENoB of 4.5 @ 30 GHz, combined with an easy to use MATLAB programming interface, Micram’s VEGA DAC4 application systems give you the power you need for PAM-4, PAM-8 and beyond.

  • Ventec Ultra-Low Dk material

    Categories: System Boards

    Ventec will unveil the industry's most advanced ultra-low Dk PCB materials for high-speed low-loss applications on Wednesday, 1st February at 8:00am. The latest products will be announced during a technical presentation which will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8. By lowering the material Dk to ultra-low levels using FR4 processes, the delicate balance of performance and cost is achieved. Higher layer counts on backplanes, daughter cards and hand-held's are achieved in a smaller footprint by having smaller layer to layer separation without sacrificing trace width. Having potentially wider traces produces lower resistance in the signal path. Combining ultra-low Dk with a low Df of 0.002 to 0.004, produces an alternative to ever smaller traces and higher power requirements.

  • verSI®

    AirBorn’s verSI® open-pin field connector line is designed to exceed requirements of high-speed, 100 Ω and 85 Ω differential signal integrity applications. The AirBorn verSI product family delivers flexibility in design by offering vertical board mount, right-angle board mount, cable I/O and flex-circuit mounting with 40 to 500 contacts. verSI®’s socket contact features four redundant points of contact, making it ultra-reliable in mission-critical applications. Vertical board-mount plugs and mating vertical receptacles also support board-to-board stacking applications. The standard offering for board spacing ranges from 8mm to 25mm with ability to tool incremental ranges to fit any application.
    The AirBorn verSI offers several board termination types including paste-in-hole, thru-hole and compliant pin press fit technology — eliminating the need for costly X-ray inspection. verSI® is a

  • VNA Measurement Verification Board

    The New 70GHz VNA “Measurement Verification Board” is a companion tool for VNA users to avoid costly swept frequency calibration errors and verify measurement drift prior to making critical measurements. A 70GHz PCB containing 50/100 Ohm and Beatty Line traces with known bandwidth performance is measured post VNA calibration and compared with accompanying S-parameter printouts for each trace. If the waveforms correlate, accurate measurements can be made confirming no VNA setting unknown to the user will adversely affect measurement accuracy. To prevent retaking erroneous measurements due to instrument drift, measurements are compared and correlated with new measurements prior to testing. Board can be ordered with 2.92mm, 2.4mm or 1.85mm connectors which determine the trace bandwidth.

  • Wireless InSite

    Categories: Design Tools

    Wireless InSite is site-specific radio propagation software for the analysis of wireless communication systems, wireless networks, sensors, radars, and other devices that transmit or receive radio waves. It provides efficient and accurate predictions of propagation and communication channel characteristics in complex urban, indoor, rural and mixed path environments. Design wireless links, optimize antenna coverage, and assess key channel and signal characteristics for RF and millimeter wave frequency bands. Applications include predicting coverage from base stations, shadowing and multipath, wireless backhaul solutions, 4G LTE, 5G MIMO and Massive MIMO, indoor WiFi networks, radar propagation, and more.

  • Wireless Power Design Kit, 15W

    Würth Elektronik and ROHM Semiconductor developed a plug & play wireless power solution to demonstrate the advantages of wireless power. This gives you the opportunity to test and integrate a wireless power solution into your product design.
    The Wireless Power Kit provides these added values:
    *Plug & Play 15 W Wireless Power Design Kit
    *Meets the Qi Standard to the Wireless Power Consortium (WPC)
    *Complete solution consisting of Tx, Rx and LED Load module
    *Flexible and modular approach for fast integration of wireless power in your product design

  • XFdtd

    Categories: Design Tools

    XFdtd Electromagnetic Simulation Software is a full wave 3D EM solver for designing and analyzing complex, high-fidelity devices. XF leads the market in FDTD-based modeling and simulation. The FDTD approach is preferred for its excellent scaling performance as the problem size grows. XF features XStream GPU Acceleration for both CPUs and GPU clusters, plus our unique Circuit Element Optimizer. And with Unlimited Memory Support, XF can simulate massive problems exceeding billions of cells. Applications include antenna design and placement, biomedical and SAR, EMI/EMC, microwave devices, radar and scattering, automotive radar, and more.

  • Yamaichi Electronics 400GbE Interconnect Family

    Yamaichi Electronics presents future 200GbE, 400GbE and coherent optics high speed interconnect products in DesignCon 2017.

    Yamaichi's CFP2, CFP4 and CFP8 connector family well perform at 200GbE and 400GbE high speed signal requirements specified with 28G-NRZ and 56G-PAM4 signaling as 200GAUI-8, 400GAUI-16, 200GAUI-4 and 400GAUI-8. Yamaichi also supports short length of copper cable solution with these CFP family interface in addition to QSFP28 and SFP28 copper cables.

    To expand current CFP2 form factor architect, Yamaichi also created CFP2-64G connectors to accommodate future CFP2-ACO (Analog Coherent Optics) module requirements, and the CFP8 connector already has same level of high performance to support up coming CFP8-ACO module market lunch.
    These connectors are fully compliant with CFP MSA mechanical requirements.