• Conference
    Jan 29–31, 2019
  • Expo
    Jan 30–31, 2019
  • Santa Clara Convention
    Center 
    | Santa Clara, CA

Kandou Bus specializes in the design of high-speed, and pin- and energy-efficient chip-to-chip links, SerDes, and associated technologies.

City: 
Lausanne
Pavilion: 
General Space
Booth Number: 
314
Show: 
DesignCon 2018
Address 1: 
EPFL Innovation Park
Address 2: 
Building I
Zip Code: 
1015
Website: 
www.kandou.com

Package Level: